EP2C5F256I8
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 158 119808 4608 256-LBGA |
|---|---|
| Quantity | 122 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 158 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 288 | Number of Logic Elements/Cells | 4608 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 119808 |
Overview of EP2C5F256I8 – Cyclone® II FPGA, 256-LBGA
The EP2C5F256I8 is an Intel Cyclone® II field programmable gate array (FPGA) supplied in a 256-ball L‑BGA package. It integrates 4,608 logic elements and 119,808 bits of on-chip memory to address low-cost embedded processing and DSP-oriented designs.
With 158 general-purpose I/O pins, a documented clocking architecture with PLLs and embedded multiplier and memory resources, this device targets compact, power-conscious designs that require deterministic logic, flexible I/O and operation across an industrial temperature range.
Key Features
- Logic Capacity 4,608 logic elements providing the programmable fabric for custom digital functions and control logic.
- Embedded Memory 119,808 bits of on-chip RAM (approximately 0.12 Mbits) for packet buffers, FIFOs, state machines and small datasets.
- I/O Resources 158 I/O pins with an I/O architecture that supports advanced I/O standards and high‑speed differential interfaces as documented for the Cyclone II family.
- Clocking & PLLs Global clock network and phase‑locked loop (PLL) support for flexible clock distribution and on-chip frequency management.
- Embedded DSP Resources Integrated multiplier resources and associated routing for efficient implementation of arithmetic and DSP functions.
- Package & Mounting 256‑LBGA surface mount package (supplier device package: 256‑FBGA, 17×17) for space-constrained PCB layouts.
- Power Core voltage supply range from 1.15 V to 1.25 V for the device core.
- Industrial Temperature Rating Rated for operation from ‑40 °C to 100 °C for use in industrial environments.
- Compliance RoHS compliant.
Typical Applications
- Embedded Processing Implement control logic, state machines and soft processors where compact, low-cost FPGA logic is required.
- DSP and Signal Processing Use embedded multipliers and on-chip memory for low-cost DSP tasks such as filtering, data formatting and aggregation.
- Industrial Control Replace fixed-function ASICs in motor control, factory automation and instrumentation where operation across ‑40 °C to 100 °C is required.
- Interface Bridging Implement protocol bridging, GPIO aggregation and I/O conditioning with 158 available I/O pins and advanced I/O support.
Unique Advantages
- Compact, high‑density logic: 4,608 logic elements provide a balance of capacity and footprint for mid‑range programmable designs.
- On-chip memory and DSP blocks: 119,808 bits of embedded RAM plus multiplier resources reduce the need for external memory and discrete DSP accelerators.
- Flexible I/O: 158 I/O pins and support for advanced I/O standards enable diverse interfacing without extensive external glue logic.
- Industrial temperature range: Rated operation from ‑40 °C to 100 °C for deployment in demanding environmental conditions.
- Low-voltage core: 1.15–1.25 V supply simplifies power‑rail planning in modern multi‑rail systems.
- RoHS compliant: Meets common environmental compliance expectations for commercial and industrial products.
Why Choose EP2C5F256I8?
The EP2C5F256I8 positions itself as a practical, mid‑capacity Cyclone II FPGA option when designers need a balance of programmable logic, embedded memory and DSP resources in a compact 256‑ball LBGA package. Its combination of 4,608 logic elements, on‑chip RAM and multiplier resources supports a wide range of embedded and signal‑processing tasks while 158 I/O pins provide broad interfacing flexibility.
With a low core voltage range and an industrial temperature rating, this device is suited for cost‑sensitive production designs that require reliable operation across varying environmental conditions. The Cyclone II family documentation provides detailed routing, clocking and I/O guidance to support efficient implementation and long‑term system development.
Request a quote or contact sales to discuss availability and pricing for EP2C5F256I8 and to get support on design integration and volume procurement.

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