EP2C5F256C7

The EP2C5F256C7 is a Cyclone® II family FPGA in a 256-LBGA package designed for cost-sensitive embedded and DSP-oriented applications. It implements the Cyclone II architecture with dedicated logic elements, embedded memory, and a versatile I/O structure to support a range of programmable digital functions.

This device is targeted at commercial applications that require a balanced combination of logic capacity, on-chip memory, and multi‑purpose I/O while operating within a 1.15 V to 1.25 V core voltage range and a 0 °C to 85 °C temperature window.

Key Features

• Logic Capacity — 4608 logic elements providing configurable resources for glue logic, state machines, and custom datapaths.
• Embedded Memory — Approximately 0.12 Mbits (119,808 bits) of on-chip RAM for buffering, FIFOs, and small data stores.
• I/O Count & Flexibility — 158 user I/O pins to support a variety of external interfaces and board-level connectivity.
• Package Options — 256-LBGA package; supplier device package listed as 256-FBGA (17×17) for compact, board-level integration.
• Low-Voltage Core — Core supply voltage range of 1.15 V to 1.25 V for compatibility with Cyclone II power domains.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for commercial embedded systems.
• Family-Level Architecture Features — Cyclone II device family architecture includes PLLs, embedded multipliers, M4K embedded memory blocks, global clock networks, advanced I/O support (including differential and series on‑chip termination options), and configuration and JTAG boundary-scan support as documented in the Cyclone II handbook.
• Regulatory & Environmental — RoHS‑compliant.

Typical Applications

• Embedded Processing — Implement control logic, peripheral interfaces, and custom accelerators for low-cost embedded systems.
• Digital Signal Processing — Use the Cyclone II DSP-oriented features for small-scale signal processing, filtering, and data path tasks.
• Interface Bridging — Act as protocol glue or interface bridge between external memory and peripherals using available I/O and on‑chip memory.
• Prototyping & Evaluation — Compact package and accessible logic/memory resources make the device suitable for board-level prototyping and proof-of-concept designs.

Unique Advantages

• Balanced Logic and Memory: 4608 logic elements paired with approximately 0.12 Mbits of embedded RAM provide a practical mix for control, buffering, and small data processing tasks.
• High I/O Count: 158 I/O pins allow designers to implement multiple interfaces and external connections without external multiplexing.
• Compact Package: 256-LBGA (256-FBGA, 17×17) simplifies PCB layout for space-constrained designs while preserving routing density.
• Low-Voltage Operation: 1.15 V to 1.25 V core supply supports Cyclone II power architectures and efficient power distribution on board.
• Proven Cyclone II Architecture: Family features such as PLLs, embedded multipliers, M4K memory blocks, and configurable I/O options enable a wide range of system-level implementations.
• RoHS Compliant: Environmentally compliant product for commercial electronics manufacturing.

Why Choose EP2C5F256C7?

The EP2C5F256C7 delivers a practical combination of logic density, embedded RAM, and I/O resources within the Cyclone II architecture, making it well suited for commercial embedded and DSP-oriented designs that require configurable hardware acceleration and flexible interfacing. Its compact 256-LBGA package and low-voltage core simplify integration into space- and power-constrained boards.

Designers seeking a commercially graded FPGA with family-level features such as PLLs, embedded multipliers, dedicated clock networks, and extensive I/O options will find the EP2C5F256C7 a capable option for prototyping and production systems where Cyclone II capabilities align with application requirements.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the EP2C5F256C7.