EP2C5F256C8N
| Part Description |
Cyclone® II Field Programmable Gate Array (FPGA) IC 158 119808 4608 256-LBGA |
|---|---|
| Quantity | 334 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 158 | Voltage | 1.15 V - 1.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 288 | Number of Logic Elements/Cells | 4608 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 119808 |
Overview of EP2C5F256C8N – Cyclone® II Field Programmable Gate Array (FPGA) IC, 4,608 Logic Elements, 119,808‑bit RAM, 158 I/O, 256‑LBGA
The EP2C5F256C8N is a Cyclone® II family FPGA from Intel (Altera) delivering 4,608 logic elements and 119,808 bits of on-chip RAM in a compact surface-mount 256‑LBGA package. Designed for cost-sensitive commercial embedded applications, it combines Cyclone II architecture features such as flexible I/O, embedded memory, and clocking resources for system-level integration.
This device targets commercial embedded systems and DSP-oriented designs where a moderate logic capacity, ample on-chip RAM, and a 158‑pin I/O footprint are required in a low-profile 17 × 17 supplier package (256‑FBGA). It is RoHS compliant and specified for 0 °C to 85 °C operation with a core supply range of 1.15 V to 1.25 V.
Key Features
- Core Architecture Cyclone II family FPGA architecture providing 4,608 logic elements for combinational and sequential logic implementation.
- Embedded Memory 119,808 bits of on-chip RAM to support local storage, buffering, and small lookup tables for embedded processing.
- I/O Capacity & Features 158 user I/O pins with the Cyclone II I/O structure that supports multiple I/O standards, programmable drive strength, slew-rate control, bus-hold, and on-chip termination options.
- Clocking & Timing Resources Family-level global clock network and PLL resources documented in the Cyclone II device handbook for flexible clock distribution and phase-locked loop functions.
- Power Core operating voltage specified at 1.15 V to 1.25 V to match system power domains and enable predictable power budgeting for commercial designs.
- Package & Mounting Surface-mount 256‑LBGA package (supplier device package: 256‑FBGA, 17 × 17 mm) for compact PCB implementations.
- Operating Range & Compliance Commercial-grade device with operating temperature 0 °C to 85 °C and RoHS compliance for regulatory and environmental compatibility.
Typical Applications
- Commercial Embedded Systems — Implement control logic, protocol handling, and glue-logic in small form-factor commercial devices.
- Low‑Cost DSP Acceleration — Use embedded memory and Cyclone II DSP resources to offload arithmetic and signal-processing tasks in cost-sensitive designs.
- User Interfaces & Peripheral Control — Drive interfaces and manage multiple I/O peripherals with 158 available I/O pins and programmable I/O features.
- Interface Bridging and Protocol Conversion — Implement protocol translation and bus bridging functions that require a mix of logic, memory, and flexible clocking.
Unique Advantages
- Highly integrated logic and memory: 4,608 logic elements paired with 119,808 bits of on-chip RAM reduce external component count and simplify board-level design.
- Flexible I/O implementation: 158 I/O pins with documented Cyclone II I/O features enable a wide range of signal standards and drive configurations.
- Compact, manufacturable package: Surface-mount 256‑LBGA (256‑FBGA, 17 × 17) balances PCB area and routing density for commercial products.
- predictable power domain: Core supply range of 1.15 V to 1.25 V facilitates power planning for compact systems.
- Documented, field-proven family features: Part of the Cyclone II family with published device handbook content covering architecture, clocking, embedded memory, and I/O capabilities.
- Regulatory readiness: RoHS compliance supports environmental and materials requirements for commercial production.
Why Choose EP2C5F256C8N?
The EP2C5F256C8N provides a balanced combination of logic density, embedded RAM, and I/O capacity in a compact BGA package, making it well suited to commercial embedded projects, low-cost DSP tasks, and interface-rich designs. As a member of the Cyclone II family, it benefits from comprehensive device documentation covering architecture, memory and multiplier resources, clocking (including PLLs), and I/O features.
Choose EP2C5F256C8N when you need a commercially graded FPGA that integrates moderate logic resources and on-chip memory with flexible I/O and documented family-level capabilities—supporting scalable implementation and reliable system integration in commercial products.
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