EP2C5F256C8

The EP2C5F256C8 is a Cyclone® II family FPGA in a compact 256-ball BGA package, offering mid-range logic density and on-chip memory suitable for cost-sensitive embedded and DSP-oriented designs. Its Cyclone II architecture provides a balance of logic resources, embedded RAM, and flexible I/O that targets low-cost embedded processing and low-cost DSP solutions.

This device features 4,608 logic elements, approximately 0.12 Mbits of embedded memory, and 158 user I/O pins, operating from a 1.15 V to 1.25 V core supply and rated for commercial temperatures (0 °C to 85 °C).

Key Features

• Logic Capacity  4,608 logic elements provide mid-range programmable logic suitable for a variety of embedded and DSP tasks.
• Embedded Memory  Approximately 0.12 Mbits of on-chip RAM (119,808 total RAM bits) supports data buffering, FIFOs, and local storage for custom logic.
• I/O Count & Flexibility  158 user I/O pins enable extensive peripheral and interface connectivity; the Cyclone II architecture includes advanced I/O standard support and high-speed differential interface capability as described in the device handbook.
• Power  Core supply voltage range of 1.15 V to 1.25 V for the device core.
• Package  256-LBGA package (supplier device package listed as 256-FBGA, 17×17) provides a compact footprint for board-level integration.
• Operating Range & Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.
• Device Documentation  Supported by the Cyclone II Device Handbook, which details architecture, configuration, I/O features, embedded multipliers, memory modes, and timing specifications.

Typical Applications

• Low-Cost Embedded Processing  Suited for compact embedded systems that require programmable logic for control, glue logic, or custom peripheral implementation.
• Low-Cost DSP Solutions  Appropriate for cost-sensitive digital signal processing tasks where dedicated logic and embedded memory can accelerate specialized algorithms.
• External Memory Interfacing  Used in designs requiring flexible external memory interfaces and on-chip resources to manage data movement.
• High-Speed I/O and Interface Bridging  Applicable where differential signaling and advanced I/O standards are required to connect diverse peripherals and high-speed links.

Unique Advantages

• Balanced Integration: 4,608 logic elements combined with on-chip RAM deliver a mid-density FPGA solution that reduces the need for external glue logic.
• Compact Package: The 256-ball BGA footprint (supplier 256-FBGA, 17×17) enables space-efficient board designs without sacrificing I/O capacity.
• Flexible I/O Capability: 158 I/O pins and documented support for advanced I/O standards and differential interfaces simplify connectivity to a wide range of peripherals.
• Low-Voltage Core: A core supply range of 1.15 V to 1.25 V aligns with low-power design practices for the device class.
• Commercial Temperature Qualification: Rated for 0 °C to 85 °C, making it suitable for mainstream consumer and industrial-lite applications.
• Standards Compliance: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose EP2C5F256C8?

The EP2C5F256C8 Cyclone II FPGA is positioned as a practical, mid-density programmable logic device for designers needing a cost-effective balance of logic elements, embedded memory, and I/O capacity in a compact package. Its documented Cyclone II architecture and device handbook provide detailed guidance on logic structures, memory modes, PLLs, and I/O features to support design and integration.

This part is well suited to teams developing low-cost embedded processors, DSP accelerators, or interface bridging solutions that require a commercially rated, RoHS-compliant FPGA with 4,608 logic elements, approximately 0.12 Mbits of on-chip RAM, and 158 I/O pins in a 256-ball BGA footprint.

Request a quote today or submit an inquiry to receive pricing and availability for the EP2C5F256C8 Cyclone II FPGA for your next design.