EP2C5AF256A7N

The EP2C5AF256A7N is a Cyclone® II family field programmable gate array (FPGA) offering 4,608 logic elements, embedded memory, and a rich I/O complement in a compact 256-LBGA package. It is provided in an automotive-grade variant with AEC‑Q100 qualification and is specified for operation from −40 °C to 125 °C.

Designed for embedded and automotive applications that require programmable logic, the device combines Cyclone II architecture elements—such as embedded memory, PLLs, and dedicated clock networks—with a 158-pin I/O count and a low-voltage core supply range of 1.15 V to 1.25 V.

Key Features

• Logic Capacity — 4,608 logic elements for implementing combinational and sequential logic functions.
• Embedded Memory — 119,808 total RAM bits (≈0.12 Mbits) of on-chip memory for buffers, FIFOs, and small data storage.
• I/O Resources — 158 general-purpose I/O pins to support multiple external interfaces and peripherals.
• Clocking and Timing — Cyclone II architecture includes a global clock network and phase-locked loops (PLLs), as documented in the device handbook.
• Dedicated DSP Support — Cyclone II family documentation includes embedded multipliers and DSP-oriented features for arithmetic and signal-processing functions.
• Packaging and Mounting — 256-LBGA package (supplier package: 256-FBGA, 17×17) with surface-mount mounting type for compact PCB layout.
• Power Supply — Core voltage specified from 1.15 V to 1.25 V to match system power rails.
• Automotive Qualification — Grade: Automotive with AEC‑Q100 qualification for designs requiring automotive-grade components.
• Operating Range — Specified operation from −40 °C to 125 °C for temperature-demanding environments.
• Regulatory — RoHS compliant.

Typical Applications

• Automotive Control Systems — Use the AEC‑Q100 qualified Cyclone II device for control logic, sensor interfacing, and custom signal processing in automotive ECUs.
• Embedded Compute and Glue Logic — Implement custom state machines, protocol bridging, or peripheral aggregation where moderate logic density and on-chip memory are required.
• Sensor and Signal Processing — Leverage on-chip memory and embedded multipliers (Cyclone II architecture feature) for pre-processing sensor data and simple DSP tasks.
• Prototyping and Low- to Mid-Scale FPGA Designs — Compact package and 4,608 logic elements make this part suitable for development and deployment of focused FPGA-based functions.

Unique Advantages

• Automotive-Grade Qualification: AEC‑Q100 qualification supports selection for designs that require automotive component-level qualification.
• Balanced Logic and Memory: 4,608 logic elements combined with 119,808 bits of embedded RAM allow compact implementations of control and buffering functions without external memory.
• Flexible I/O Count: 158 I/O pins provide flexibility for multiple interfaces and peripherals, reducing the need for external I/O expanders.
• Compact Surface-Mount Package: 256-LBGA (256-FBGA, 17×17) helps conserve PCB area while providing a dense pinout for routing.
• Extended Temperature Range: Specified −40 °C to 125 °C operation supports deployment in temperature-stressed environments.
• Standards Compliance: RoHS compliance facilitates use in regulated manufacturing environments.

Why Choose EP2C5AF256A7N?

The EP2C5AF256A7N positions Cyclone II family capabilities—embedded memory, clocking resources, and DSP-oriented elements—into an automotive‑qualified FPGA package. It is appropriate for designers who need a mid-range logic device with a compact BGA footprint, a substantial I/O count, and temperature and qualification characteristics suitable for automotive and embedded system applications.

Choosing this part supports designs that require proven Cyclone II architecture features documented in the device handbook, while providing the long-term availability and compliance details needed for regulated environments.

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