EP2C50F484C6N

The EP2C50F484C6N is an Intel Cyclone II family FPGA offering a mid-range logic capacity in a compact 484-ball BGA package. Built on the Cyclone II architecture, the device targets low-cost embedded processing and DSP-focused designs that need on-chip logic, memory and flexible I/O in a surface-mount form factor.

Key on-chip resources include 50,528 logic elements, approximately 0.594 Mbits of embedded memory (594,432 bits), and 294 user I/O pins. The device operates from a 1.15 V to 1.25 V core supply and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Architecture  Cyclone II FPGA architecture with documented global clock network and PLL support as described in the Cyclone II device handbook.
• Logic Capacity  50,528 logic elements to implement mid-density combinational and sequential logic functions.
• Embedded Memory  Approximately 0.594 Mbits of on-chip RAM (594,432 bits) with Cyclone II M4K memory block support and flexible memory modes.
• DSP Support  Embedded multiplier resources and multiplier routing interfaces provided by the Cyclone II family for DSP and arithmetic-heavy operations.
• I/O Resources  294 user I/O pins with support for multiple I/O standards, programmable drive strength, slew rate control and features described in the I/O chapter of the device handbook.
• Power and Temperature  Core voltage supply range of 1.15 V to 1.25 V; commercial operating temperature range 0 °C to 85 °C.
• Package and Mounting  Surface-mount 484-BGA (supplier device package: 484-FBGA, 23×23) optimized for space-constrained board designs.
• Compliance  RoHS compliant.

Typical Applications

• Low-Cost Embedded Processing  Implement control and interface logic for cost-sensitive embedded systems using the Cyclone II architecture and on-chip resources.
• Digital Signal Processing (DSP)  Deploy arithmetic blocks and embedded multipliers for DSP functions in communications, audio or signal-conditioning applications.
• High-Speed I/O and Memory Interfaces  Use the device’s I/O features and external memory interfacing capabilities for board-level data transfers and memory controllers.
• Custom Logic and Prototyping  Realize custom state machines, protocol bridges, and interface logic within a compact BGA package for evaluation and production designs.

Unique Advantages

• Substantial Logic Density: 50,528 logic elements provide a balance of capacity for mid-range designs without moving to larger families.
• On-Chip Memory Integration: Approximately 0.594 Mbits of embedded RAM reduces external memory dependency for many control and buffering functions.
• Flexible I/O Capability: 294 user I/Os and documented support for multiple I/O standards simplify interfacing to peripherals and external devices.
• Compact BGA Package: 484-ball FBGA (23×23) surface-mount package enables high-density board layouts in space-constrained applications.
• Documented Architecture: Backed by the Cyclone II device handbook covering architecture, configuration, I/O and timing details to assist development and integration.
• Regulatory Compliance: RoHS compliance supports modern assembly and environmental requirements.

Why Choose EP2C50F484C6N?

The EP2C50F484C6N positions itself for engineers and procurement teams seeking a Cyclone II FPGA that combines a solid logic element count, embedded memory, and broad I/O in a compact BGA package. Its documented Cyclone II architecture and device handbook provide the technical detail required for embedded processing and DSP designs that prioritize integration and predictable operating conditions.

This part is suitable for mid-range applications that need integrated logic, RAM and configurable I/O while operating within commercial temperature and the specified core-voltage window. The combination of on-chip resources and documented device features supports efficient design cycles for production and evaluation platforms.

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