EP2C35F672C7

The EP2C35F672C7 is an Intel Cyclone® II Field Programmable Gate Array (FPGA) offered in a 672-BGA package. It implements the Cyclone II architecture and provides a balance of programmable logic, embedded memory, and a high pin count for I/O-intensive designs.

With 33,216 logic elements, approximately 0.48 Mbits of embedded memory and 475 available I/Os, this device targets low-cost embedded processing and DSP-oriented applications that require substantial logic capacity and flexible I/O connectivity while operating within commercial temperature and voltage ranges.

Key Features

• Logic Capacity — 33,216 logic elements to implement medium-scale programmable logic, custom control and data-path functions.
• Embedded Memory — Total on-chip RAM of 483,840 bits (approximately 0.48 Mbits) for buffering, FIFOs, and small embedded storage needs.
• I/O Density — 475 user I/Os to support wide parallel interfaces, multi-channel data paths, and extensive peripheral connectivity.
• Power and Voltage — Core voltage supply range from 1.15 V to 1.25 V, enabling compatibility with Cyclone II device family power schemes.
• Package and Mounting — 672-BGA package (supplier package: 672-FBGA (27x27)) with surface-mount mounting for compact board-level integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C suitable for standard consumer and commercial applications.
• Standards and Compliance — RoHS compliant to support regulatory requirements for lead-free assembly.
• Cyclone II Family Architecture — Series-level handbook coverage includes global clock networks, phase-locked loops (PLLs), embedded multipliers, and I/O structure and features for system-level design (refer to Cyclone II device handbook for full details).

Typical Applications

• Low-Cost Embedded Processing — Implement control logic, custom processors or glue logic in cost-sensitive embedded products where a balance of logic and memory is required.
• DSP and Signal Processing — Suitable for low-cost DSP solutions that leverage Cyclone II family features such as embedded multipliers and on-chip memory for moderate-throughput signal paths.
• I/O-Intensive Interfaces — Ideal for designs requiring many parallel interfaces, wide buses, or multiple peripheral channels thanks to 475 I/Os.

Unique Advantages

• Substantial Logic Resource: 33,216 logic elements enable implementation of complex state machines, custom datapaths, and medium-scale integration without external ASICs.
• Embedded Memory On-Die: Approximately 0.48 Mbits of on-chip RAM reduces external memory dependency for buffering and small data stores.
• High I/O Count: 475 I/O pins provide flexibility for multi-channel data acquisition, interface aggregation, and broad peripheral connectivity.
• Compact Board Integration: 672-BGA (672-FBGA (27x27)) surface-mount package supports dense PCB layouts while maintaining high pin count.
• Commercial Temperature Support: Rated for 0 °C to 85 °C to meet typical consumer and commercial environment requirements.
• RoHS Compliant: Meets lead-free regulatory requirements for modern manufacturing processes.

Why Choose EP2C35F672C7?

The EP2C35F672C7 positions itself as a versatile Cyclone II FPGA option for designers seeking a balance of programmable logic, embedded memory, and extensive I/O in a single commercial-grade device. Its combination of 33,216 logic elements, approximately 0.48 Mbits of on-chip RAM, and 475 I/Os provides a practical platform for low-cost embedded processing and DSP-oriented designs where board-level integration and moderate performance are priorities.

Designed around the Cyclone II family architecture, the device benefits from series-level features such as configurable clock networks and embedded DSP resources documented in the Cyclone II device handbook, making it suitable for customers who require a supported, established FPGA solution with clearly specified electrical and thermal operating ranges.

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