EP2C35F672C6

The EP2C35F672C6 is an Intel Cyclone® II FPGA provided in a 672-ball BGA package for surface-mount applications. It integrates 33,216 logic elements, approximately 0.48 Mbits of embedded memory, and 475 I/O pins to support mid-density programmable logic designs.

Designed for commercial-grade embedded and DSP-oriented applications, the device family datasheet documents architecture-level features such as global clock networks and PLLs, embedded multipliers, flexible I/O structure, and standard configuration and testing support.

Key Features

• Logic Capacity — 33,216 logic elements for implementing mid-density custom logic, state machines, and glue logic.
• Embedded Memory — 483,840 bits (approximately 0.48 Mbits) of on-chip RAM to support buffering, FIFOs, and embedded data storage.
• I/O Count — 475 general-purpose I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Package — 672-ball BGA (672-FBGA, 27×27) surface-mount package for high pin count and compact board layout.
• Power — Core supply range from 1.15 V to 1.25 V to match Cyclone II core voltage requirements.
• Operating Range — Commercial operating temperature range of 0 °C to 85 °C.
• Configuration & Test — Family documentation includes IEEE 1149.1 (JTAG) boundary-scan support and configuration options for system-level integration.
• Clocking & DSP Support — Datasheet describes global clock networks, PLLs, and embedded multiplier blocks for DSP and timing-critical designs.
• Compliance — RoHS status: Compliant for lead-free manufacturing processes.

Typical Applications

• Embedded Processing — Low-cost embedded processing solutions where programmable logic and embedded memory are used to implement custom accelerators and control logic.
• Digital Signal Processing — Low-cost DSP solutions leveraging the family’s embedded multipliers and memory for signal filtering and arithmetic pipelines.
• High‑I/O Interface Bridging — Applications requiring dense I/O—parallel buses, multiple peripherals, or complex interface conversion—benefit from 475 I/O pins.
• External Memory Interfacing — Designs that require controlled external memory interfaces, supported by the family’s documented external memory interfacing features.

Unique Advantages

• High logic density in a compact package: 33,216 logic elements in a 672-BGA footprint help consolidate multiple functions into a single FPGA.
• Significant on-chip RAM: Approximately 0.48 Mbits of embedded memory reduces external memory needs for many buffering and control tasks.
• Extensive I/O availability: 475 I/O pins provide flexibility for parallel interfaces, board-level routing, and multi-peripheral connectivity.
• Documented clocking and DSP resources: Global clock network and PLL support, plus embedded multipliers described in the datasheet, enable timing control and arithmetic acceleration.
• Commercial-grade suitability: 0 °C to 85 °C operating range and surface-mount 672-FBGA package suit standard commercial embedded product environments.
• Standards-based configuration and testing: JTAG boundary-scan and configuration features documented in the Cyclone II handbook simplify board bring-up and validation.

Why Choose EP2C35F672C6?

The EP2C35F672C6 provides a balanced combination of logic capacity, embedded memory, and extensive I/O in a commercial-grade Cyclone II FPGA. Its documented architecture—covering clocking, memory, multipliers, and I/O structure—supports a variety of mid-density embedded and DSP-focused designs where integration and predictable behavior are important.

This device is well suited for engineers and procurement teams building commercial embedded systems that require a programmable, mid-density logic fabric with comprehensive datasheet guidance and RoHS compliance for lead-free manufacturing flows.

Request a quote or submit a product inquiry to receive pricing and availability information for the EP2C35F672C6.