EP2C35F672C6N

The EP2C35F672C6N is an Intel Cyclone® II Field Programmable Gate Array (FPGA) in a 672‑ball BGA package designed for commercial embedded and DSP applications. Built on the Cyclone II architecture, it delivers a balance of programmable logic density, on‑chip memory, and flexible I/O for systems requiring moderate logic resources and multi‑bank interfacing.

This device targets designers of low‑cost embedded processing and DSP solutions who need a configurable, low‑voltage FPGA with a compact surface‑mount package and broad I/O capability.

Key Features

• Logic Capacity  Approximately 33,216 logic elements to implement mid‑range custom logic, state machines, and datapath functions.
• Embedded Memory  Approximately 0.48 Mbits of on‑chip RAM for buffers, FIFOs, and small data stores.
• I/O Density & Flexibility  475 user I/O pins support multi‑bank signalling and a variety of I/O standards; on‑chip features described in the Cyclone II handbook include programmable drive strength, pull‑ups, and support for high‑speed differential interfaces.
• Clocking & DSP Support  Cyclone II architecture provides a global clock network and phase‑locked loops (PLLs), along with embedded multiplier resources for common DSP tasks as documented in the device handbook.
• Package & Mounting  Surface‑mount 672‑BGA package (supplier package: 672‑FBGA, 27×27 mm) for compact board integration.
• Power & Supply  Core voltage range 1.15 V to 1.25 V to match Cyclone II family power domains.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation for standard commercial applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Embedded processing  Implement custom control logic, soft processors, and peripheral interfaces for cost‑sensitive embedded systems.
• DSP acceleration  Use embedded multipliers and on‑chip RAM to offload real‑time signal processing tasks.
• External memory interfacing  Bridge and control external memory devices using the Cyclone II I/O structure and dedicated memory interfacing features.
• High‑speed I/O bridging  Enable protocol conversion and high‑speed differential interface support between subsystems.

Unique Advantages

• Balanced logic and memory mix: Delivers roughly 33k logic elements alongside approximately 0.48 Mbits of embedded RAM for combined logic and buffering needs.
• High I/O count: With 475 I/O pins, the device supports complex multi‑bank interfacing without external expanders.
• Compact BGA form factor: The 672‑ball FBGA (27×27 mm) package enables dense board layouts while maintaining reliability of a surface‑mount solution.
• Low‑voltage core: Operates at a 1.15–1.25 V core supply, consistent with Cyclone II family power architectures.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation to match standard commercial product deployments.
• Standards and features documented: The Cyclone II device handbook describes clocking, PLLs, embedded multipliers, memory modes, and advanced I/O options to support system design and integration.

Why Choose EP2C35F672C6N?

The EP2C35F672C6N positions itself as a practical choice for designers needing a Cyclone II FPGA with mid‑range logic capacity, substantial I/O, and embedded resources for embedded processing and DSP tasks. Its combination of approximately 33,216 logic elements, on‑chip memory, and documented Cyclone II architectural features makes it suitable for board designs requiring configurable logic, interface bridging, and local data buffering.

Backed by the Cyclone II device documentation from the vendor, this commercial‑grade FPGA is appropriate for development and production systems where low‑voltage operation, package density, and RoHS compliance are key considerations.

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