EP2C35F484C6

The EP2C35F484C6 is an Intel Cyclone® II family FPGA in a 484-BGA (484-FBGA, 23×23) surface-mount package. It provides 33,216 logic elements with 2,076 LABs and approximately 0.484 Mbits of embedded memory, making it suitable for designs that require moderate logic capacity and on-chip RAM.

Designed for commercial-grade applications, the device offers a 322-pin I/O count, a 1.15 V to 1.25 V core supply range, and an operating temperature range of 0 °C to 85 °C. Typical use cases include low-cost embedded processing and DSP-oriented applications where a balance of logic, RAM, and I/O is needed.

Key Features

• Logic Capacity — 33,216 logic elements organized across 2,076 LABs to implement medium-complexity digital logic and control functions.
• Embedded Memory — Approximately 0.484 Mbits of on-chip RAM for buffering, state storage, and small-memory applications.
• I/O Density — 322 user I/O pins to support parallel interfaces, control signals, and mixed I/O requirements.
• Voltage Supply — Core supply specified from 1.15 V to 1.25 V to match system power rails and regulator choices.
• Package & Mounting — 484-FBGA (23×23) package in a surface-mount form factor for compact PCB implementations.
• Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial deployments.
• Environmental Compliance — RoHS compliant to meet common environmental requirements.
• Documentation — Device is part of the Cyclone II family; detailed device architecture, I/O, memory, and configuration information is available in the Cyclone II Device Handbook.

Typical Applications

• Embedded Processing — Implement custom peripheral control, glue logic, and processing accelerators for low-cost embedded systems using the Cyclone II architecture.
• Digital Signal Processing (DSP) — Deploy moderate-complexity DSP functions and data-paths that benefit from on-chip RAM and the available logic resources.
• I/O-Intensive Control — Use the 322 I/Os for interfacing multiple sensors, actuators, or parallel buses in industrial and commercial control applications.
• Prototyping and Education — Suitable for board-level prototyping and academic projects that require a representative FPGA with ample logic and I/O capacity.

Unique Advantages

• Generous Logic Density: 33,216 logic elements enable implementation of substantial custom logic without external gate arrays.
• Balanced On-Chip Memory: Approximately 0.484 Mbits of embedded RAM reduces dependence on external memory for small to moderate buffering tasks.
• High I/O Count: 322 user I/Os provide flexibility for multi-channel interfaces and parallel connectivity on a single device.
• Compact BGA Package: 484-FBGA (23×23) delivers a high-pin-count solution in a space-efficient surface-mount package suitable for compact PCB layouts.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet typical commercial product requirements and deployment environments.
• RoHS Compliant: Conforms to RoHS environmental requirements for modern manufacturing and regulatory needs.

Why Choose EP2C35F484C6?

The EP2C35F484C6 positions itself as a Cyclone II FPGA option for commercial designs needing a balance of logic density, embedded memory, and substantial I/O in a compact BGA package. Its documented Cyclone II architecture and available device handbook offer the necessary technical detail for system architects and hardware engineers to plan implementations precisely.

This device is well suited to teams building low-cost embedded processing, DSP functions, and I/O-rich control systems who require predictable electrical characteristics (1.15 V–1.25 V core) and commercial temperature operation. The combination of logic elements, on-chip RAM, and I/O makes it a practical choice for mid-range FPGA applications within the Intel Cyclone II family.

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