EP2C20AF256A7N

The EP2C20AF256A7N is a Cyclone® II family FPGA offering mid-range logic density and on-chip resources for embedded processing and DSP-oriented designs. Built on the Cyclone II architecture, it provides 18,752 logic elements and approximately 0.24 Mbits of embedded memory, supporting flexible I/O and system integration for applications that require automotive qualification and extended temperature operation.

This device is supplied in a compact 256-LBGA package for surface-mount assembly, features a 152-pin I/O count, and operates from a core supply of 1.15 V to 1.25 V. It carries AEC-Q100 qualification and is rated for operation from −40 °C to 125 °C.

Key Features

• Core Architecture  Cyclone II FPGA family architecture with 18,752 logic elements and 1,172 LABs for implementing combinational and sequential logic functions.
• Embedded Memory & DSP  Approximately 239,616 bits of on-chip RAM (~0.24 Mbits) and architecture-level support for embedded multipliers and DSP-focused resources as documented in the Cyclone II handbook.
• I/O Capability  152 I/O pins to support diverse interfacing and peripheral connections with programmable I/O features described in the device handbook.
• Package & Mounting  256-LBGA surface-mount package (supplier device package: 256-FBGA, 17×17) for compact PCB integration.
• Power  Low-voltage core operation with a supply range of 1.15 V to 1.25 V to match system power-rail requirements.
• Automotive Qualification & Temperature Range  Automotive-grade device with AEC-Q100 qualification and an operating temperature range of −40 °C to 125 °C.
• Standards & Compliance  RoHS-compliant device meeting environmental sourcing requirements.

Typical Applications

• Automotive Control Systems  Suitable for automotive ECUs and control modules where AEC-Q100 qualification and extended temperature range are required.
• Embedded Processing  Ideal for compact embedded processing tasks that leverage on-chip logic and memory for custom control, protocol handling, or glue logic.
• DSP and Signal Processing  Targeted for low-cost DSP solutions and media-processing blocks that benefit from the Cyclone II architecture’s embedded multipliers and memory resources.
• Flexible I/O Interfaces  Useful in systems requiring programmable I/O for sensor interfacing, peripheral aggregation, or custom communication endpoints.

Unique Advantages

• Automotive-Grade Qualification: AEC-Q100 qualification supports deployment in automotive environments requiring rigorous component qualification.
• Balanced Logic and Memory: 18,752 logic elements combined with approximately 0.24 Mbits of embedded RAM provide a well-rounded resource mix for mid-range designs.
• High I/O Density in a Small Package: 152 I/Os in a 256-LBGA (17×17) footprint enable rich external interfacing while conserving PCB area.
• Wide Operating Temperature: Rated from −40 °C to 125 °C for reliable operation across harsh thermal environments.
• Low-Voltage Core: 1.15 V to 1.25 V core supply reduces power-rail complexity for modern system designs.
• Standards Compliance: RoHS compliance helps meet environmental and regulatory requirements for electronic assemblies.

Why Choose EP2C20AF256A7N?

The EP2C20AF256A7N positions itself as a practical, automotive-qualified FPGA choice for engineers needing a mid-density programmable device with dependable on-chip memory and DSP-oriented resources. Its combination of 18,752 logic elements, substantial embedded RAM, and 152 I/Os in a space-saving 256-LBGA package makes it well suited for embedded control, signal processing, and interface-centric applications.

Designed for robustness and long-term deployment, this Cyclone II device offers a balance of performance, integration, and qualification that supports scalable designs and facilitates implementation within established FPGA toolflows and documentation provided in the Cyclone II Device Handbook.

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