EP2C15AF484C8N

The EP2C15AF484C8N is an Intel Cyclone® II family FPGA in a 484-ball FBGA (23×23) surface-mount package designed for commercial embedded and DSP-oriented applications. It integrates 14,448 logic elements, approximately 0.24 Mbits of on-chip RAM, and 315 general-purpose I/Os, delivering mid-range integration density for board-level systems.

With a core supply voltage range of 1.15 V to 1.25 V, RoHS compliance, and an operating temperature range of 0 °C to 85 °C, this device is suited to a wide range of low-cost embedded processing and DSP use cases where a balance of logic capacity, on-chip memory, and high I/O count is required.

Key Features

• Logic Capacity: 14,448 logic elements provide mid-range programmable logic resources for glue logic, state machines, and custom accelerators.
• On-Chip Memory: Approximately 0.24 Mbits of embedded RAM for data buffering, small FIFOs, and local storage without external memory.
• I/O Resources: 315 available I/Os to support multiple parallel interfaces, peripherals, and board-level connectivity.
• Package & Mounting: 484-FBGA (23×23) surface-mount package for high pin density in a compact footprint.
• Power Supply: Core voltage support from 1.15 V to 1.25 V to match standard Cyclone II power rails.
• Operating Range & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Family Architecture Features: Cyclone II device handbook documentation describes embedded multipliers, PLLs, a global clock network, programmable I/O features (including differential interfaces and programmable drive strength), and JTAG boundary-scan support for configuration and testing.
• Regulatory Compliance: RoHS compliant for lead-free assembly requirements.

Typical Applications

• Embedded Processing: Implement control logic, protocol bridges, and custom interfaces using the device’s logic elements and on-chip memory for compact embedded systems.
• Digital Signal Processing: Use the Cyclone II family’s DSP-oriented features and embedded resources for low-cost DSP functions and dataflow tasks.
• High-Density I/O Systems: Leverage 315 I/Os to consolidate multiple interfaces on a single FPGA for communications, sensor aggregation, or multi-peripheral controller boards.
• Board-Level Acceleration: Offload critical state machines and parallel tasks to reduce host CPU load while minimizing external memory requirements.

Unique Advantages

• Mid-Range Integration: 14,448 logic elements with embedded RAM enable consolidation of multiple discrete devices into a single FPGA, reducing bill of materials and PCB complexity.
• High I/O Count: 315 I/Os simplify system partitioning by supporting numerous parallel interfaces without external I/O expanders.
• Compact, High-Density Package: 484-FBGA (23×23) provides high pin count in a space-efficient footprint for dense board designs.
• Commercial Temperature Rating: 0 °C to 85 °C supports a broad set of general-purpose applications while maintaining predictable operating parameters.
• Design and Test Support: Family-level documentation includes configuration, JTAG boundary-scan, clocking, and I/O features to streamline development and bring-up.
• Regulatory Alignment: RoHS compliance facilitates use in lead-free production environments.

Why Choose EP2C15AF484C8N?

EP2C15AF484C8N positions itself as a practical Cyclone II family FPGA for designers seeking a balance of logic density, on-chip memory, and a high I/O count in a compact 484-FBGA package. Its documented family features—such as embedded memory, clocking resources, programmable I/O capabilities, and configuration/testing support—help reduce external components and simplify system design.

This device is well suited to teams developing low-cost embedded processing and DSP solutions who require clear device specifications, RoHS compliance, and accessible documentation from the Cyclone II device handbook to support implementation and validation.

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