EP2C15AF484C6NES

IC FPGA 315 I/O 484FBGA
Part Description

Cyclone® II Field Programmable Gate Array (FPGA) IC 315 239616 14448 484-BGA

Quantity 1,570 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O315Voltage1.15 V - 1.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs903Number of Logic Elements/Cells14448
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits239616

Overview of EP2C15AF484C6NES – Cyclone® II Field Programmable Gate Array (FPGA) – 484-BGA

The EP2C15AF484C6NES is an Intel Cyclone® II Field Programmable Gate Array supplied in a 484-ball BGA package. It delivers 14,448 logic elements, approximately 0.24 Mbits of embedded memory, and 315 general-purpose I/O pins in a surface-mount 484-FBGA (23×23) package.

Designed for commercial-grade projects, this FPGA targets designers who need a mid-density programmable logic device with a constrained voltage supply range and a standard commercial operating temperature window.

Key Features

  • Core Logic 14,448 logic elements provide arrayed resources for implementing custom digital logic and IP integration.
  • Embedded Memory Approximately 0.24 Mbits of on-chip RAM for buffering, state storage, and small data structures.
  • I/O Capacity 315 I/O pins enable broad interfacing to peripherals, buses, and external devices from a single device.
  • Power Operates from a specified supply range of 1.15 V to 1.25 V, suitable for systems designed around this core voltage.
  • Package & Mounting 484-ball BGA (484-FBGA, 23×23) surface mount package provides a compact footprint for board-level integration.
  • Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operating temperature.
  • Compliance RoHS compliant.

Typical Applications

  • Custom Digital Logic Implement application-specific logic blocks and state machines using 14,448 logic elements and on-chip RAM.
  • Peripheral Bridging and I/O Expansion Use the 315 I/O pins to consolidate multiple interfaces or bridge disparate peripherals on a single FPGA.
  • Prototyping and Evaluation Leverage the Cyclone II architecture and mid-range resource set for early-stage hardware validation and proof-of-concept builds.

Unique Advantages

  • Balanced Logic and Memory: 14,448 logic elements paired with approximately 0.24 Mbits of RAM support a wide range of mid-density logic functions without external SRAM for many tasks.
  • High I/O Count: 315 I/O pins reduce the need for external I/O expanders and simplify board-level routing for complex interfacing.
  • Compact BGA Package: 484-FBGA (23×23) offers a small board footprint while maintaining ample I/O and logic resources.
  • Predictable Power Envelope: Narrow supply range (1.15–1.25 V) aids in power supply design and system-level power budgeting.
  • Commercial-Grade Availability: Designed for applications operating within the 0 °C to 85 °C range where RoHS compliance is required.

Why Choose EP2C15AF484C6NES?

The EP2C15AF484C6NES offers a practical combination of logic density, embedded memory, and high I/O count in a compact 484-BGA footprint. As part of the Cyclone® II family, it is suited to designers seeking a mid-range FPGA solution for commercial applications that require on-chip RAM and extensive interfacing capability.

Its defined operating voltage and commercial temperature grade make it appropriate for controlled-environment systems and development platforms where predictable electrical and thermal behavior is important. The device’s resource mix supports scalable designs that balance functionality and board-level integration.

Request a quote or submit a parts inquiry to get pricing and availability information for EP2C15AF484C6NES.

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