EP2C15AF484A7N

The EP2C15AF484A7N is a Cyclone® II family FPGA from Intel, delivered in a 484-ball BGA (23×23) surface-mount package. It provides a mid-range programmable logic solution with on-chip memory, DSP-friendly resources and a rich I/O complement targeted at embedded processing and interface applications.

Designed and qualified for automotive applications (AEC‑Q100), this device combines 14,448 logic elements with embedded RAM and a comprehensive I/O feature set, offering a compact, automotive‑grade programmable platform for systems requiring configurability across a wide temperature range.

Key Features

• Core Logic  14,448 logic elements for implementing combinational and sequential logic, state machines, and custom datapaths.
• Embedded Memory  Approximately 0.24 Mbits of on-chip RAM (239,616 total RAM bits) for buffering, FIFOs and small memory structures.
• I/O Capacity & Flexibility  315 I/O pins with support for advanced I/O standards, programmable drive strength, slew rate control and on‑chip termination options as described in the device documentation.
• Clocking & DSP Resources  Includes a global clock distribution network, phase-locked loops (PLLs) and embedded multipliers to support synchronized clocking and DSP-oriented arithmetic operations.
• Configuration & Test  IEEE 1149.1 (JTAG) boundary-scan support and standard configuration schemes described in the Cyclone II device handbook.
• Package & Power  484‑FBGA (23×23) surface-mount package; core supply voltage range 1.15 V to 1.25 V for core power planning.
• Automotive Qualification & Thermal Range  Qualified to AEC‑Q100 and specified for operation from −40 °C to 125 °C.
• Compliance  RoHS compliant.
• System Reliability Features  Documentation includes Hot-Socketing, Power‑On Reset and single-event upset detection guidance for robust system integration.

Typical Applications

• Embedded processing  Ideal for low-cost embedded processing blocks where programmable logic enables custom peripherals, glue logic and protocol handling.
• Digital signal processing  Use embedded multipliers and distributed memory for DSP acceleration in signal conditioning, filtering and control loops.
• High-speed interface bridging  Large I/O count and advanced I/O options make the device suitable for protocol translation and interface aggregation between subsystems.
• Automotive control systems  AEC‑Q100 qualification and extended temperature rating support usage in vehicle control, sensor fusion and body electronics applications.
• External memory interfacing  Built‑in I/O and routing resources support external memory interfaces and board-level memory controllers described in the device handbook.

Unique Advantages

• Significant programmable capacity: 14,448 logic elements provide ample resources for mid-range custom logic and control implementations.
• On-chip memory for compact designs: Approximately 0.24 Mbits of embedded RAM reduces external memory requirements for small buffers and state storage.
• Automotive-grade qualification: AEC‑Q100 rating and −40 °C to 125 °C operating range support deployment in automotive environments requiring qualified components.
• Comprehensive clocking and DSP support: Global clock networks, PLLs and embedded multipliers facilitate synchronized designs and arithmetic-heavy functions.
• High I/O density and programmability: 315 I/O pins with programmable drive, termination and advanced I/O standard support simplify board-level interfacing.
• Compact BGA packaging: 484‑FBGA (23×23) surface-mount package balances pin count and board footprint for space-conscious applications.

Why Choose EP2C15AF484A7N?

The EP2C15AF484A7N positions itself as a versatile Cyclone II FPGA option for engineers needing a balance of programmable logic, embedded memory and DSP resources in an automotive‑qualified package. Its combination of 14,448 logic elements, integrated RAM and comprehensive I/O capability supports a wide range of embedded processing and interface tasks while meeting AEC‑Q100 qualification and an extended thermal range.

This device is a fit for designs that require predictable, documented device behavior from the Cyclone II family, compact BGA packaging and automotive readiness for deployment in systems where configurability, integration and temperature robustness are key considerations.

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