EP2C15AF484I8N

The EP2C15AF484I8N is an Intel Cyclone® II FPGA in a 484-ball BGA package, offered in an industrial-grade temperature range. It combines 14,448 logic elements with a flexible I/O fabric and on-chip resources targeted at low-cost embedded processing and DSP-oriented applications.

Designed for systems that require moderate logic density, substantial I/O count, and low-voltage operation, this device addresses industrial control, embedded acceleration, and interface-bridging use cases while supporting standard FPGA configuration and clocking features.

Key Features

• Logic Capacity — 14,448 logic elements for implementing glue logic, state machines, and mid-sized custom accelerators.
• Embedded Memory — Approximately 0.24 Mbits of on-chip RAM (239,616 bits) to support FIFOs, small buffers, and local storage without external memory.
• I/O Resources — 315 user I/Os to support wide parallel interfaces, multiple peripherals, and external memory connections.
• Power and Voltage — Core supply range of 1.15 V to 1.25 V to match system power rails and enable low-voltage operation.
• Industrial Temperature Grade — Specified for operation from −40 °C to 100 °C for demanding environments.
• Package and Mounting — 484-BGA package (supplier device package: 484-FBGA, 23×23) with surface-mount construction for compact board integration.
• Clocking and DSP-Friendly Blocks — Device family features global clock networks, PLLs, and embedded multipliers to support synchronous designs and DSP tasks.
• I/O and Interface Features — Architecture documentation references advanced I/O capabilities such as programmable drive strength, series on-chip termination, differential interfaces, and multi-voltage I/O bank support.
• Configuration & Test — JTAG boundary-scan support and a variety of configuration schemes are documented for device programming and system test.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Processing — Implement microcontroller peripherals, custom accelerators, and control logic using the device’s logic elements and on-chip RAM.
• DSP and Signal Processing — Use embedded multipliers and synchronous clocking resources for low-cost DSP functions and data-path acceleration.
• Industrial Control & Automation — Leverage the industrial temperature range and extensive I/O to interface sensors, actuators, and fieldbus peripherals.
• Interface Bridging & Protocol Conversion — Large I/O count and configurable I/O standards support protocol translation and external memory interfacing tasks.

Unique Advantages

• Balanced Logic and Memory — 14,448 logic elements combined with approximately 0.24 Mbits of embedded RAM enable compact implementations of control and buffering functions without external SRAM.
• High I/O Density — 315 I/Os allow broad peripheral connectivity and parallel bus support, reducing the need for external interface components.
• Industrial Reliability — Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact Package — 484-BGA (23×23) surface-mount package helps save PCB area while providing the signal density required for complex I/O routing.
• Low-Voltage Core — 1.15 V to 1.25 V core supply range aligns with modern low-voltage power domains for efficient system design.
• Integrated Clocking and DSP Resources — Documented global clock networks, PLLs, and embedded multipliers simplify timing architectures and accelerate DSP workloads.

Why Choose EP2C15AF484I8N?

The EP2C15AF484I8N places a practical mix of logic capacity, on-chip memory, and a high I/O count into an industrial-grade Cyclone II package. It is suited to designers needing a mid-range FPGA option for embedded processing, interface bridging, and DSP-lean implementations where temperature resilience and compact packaging matter.

Backed by documented family-level features such as programmable I/O, clock management, and standard configuration and test mechanisms, this device provides a clear upgrade path within the Cyclone II device family while delivering predictable integration into industrial and embedded systems.

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