EP2AGZ350FH29I4N

The EP2AGZ350FH29I4N is an Intel Arria II GZ field-programmable gate array (FPGA) offered in an industrial-grade package. It delivers high logic density and substantial on-chip memory for complex, programmable digital designs.

Built for applications that require large programmable fabric and extensive I/O, this device combines 348,500 logic elements with approximately 21.27 Mbits of embedded memory and 281 user I/O pins. Its industrial temperature rating and robust BGA package make it suitable for demanding environments.

Key Features

• Core & logic capacity  348,500 logic elements provide a large programmable fabric for implementing complex digital logic and state machines.
• Embedded memory  Approximately 21.27 Mbits of on-chip RAM to support buffering, packet memory, and algorithmic storage requirements.
• High I/O density  281 user I/O pins accommodate wide parallel interfaces, buses, and mixed-signal front-end connections.
• Power supply range  Core supply operating range of 870 mV to 930 mV for the device core and associated on-chip logic domains.
• Industrial operating range  Rated for operation from –40 °C to 100 °C, aligning the device for industrial-temperature applications.
• Package and mounting  780‑BBGA (FCBGA) package; supplier device package listed as 780‑HBGA (33×33). Surface-mount mounting type supports standard PCB assembly processes.
• Standards and compliance  RoHS‑compliant material status.
• Arria II device family support  Device handbook for the Arria II family documents electrical characteristics, transceiver performance specifications, and I/O timing for Arria II GX and GZ devices.

Typical Applications

• High-density signal processing  Large logic capacity and on-chip RAM enable implementation of complex DSP pipelines, data-paths, and custom accelerators.
• Protocol bridging and interface aggregation  281 I/O pins and extensive programmable fabric support aggregation, protocol conversion, and glue-logic for multi-interface systems.
• Industrial and embedded control  Industrial grade and wide operating temperature make the device suitable for embedded controllers, robotics control logic, and factory automation systems.

Unique Advantages

• Large programmable fabric: 348,500 logic elements allow dense, feature-rich designs without immediate scaling to larger device families.
• Substantial on-chip memory: Approximately 21.27 Mbits of embedded RAM reduces external memory dependency for many buffering and state-storage needs.
• High I/O count: 281 I/O pins deliver flexibility for parallel buses, sensor interfaces, and mixed-signal front ends.
• Industrial readiness: Rated for –40 °C to 100 °C operation to address temperature-sensitive deployments in industrial environments.
• Robust BGA packaging: 780‑BBGA (FCBGA) package and surface-mount form factor support compact, high-density board designs.
• RoHS compliant: Environmentally compliant materials simplify design compliance requirements.

Why Choose EP2AGZ350FH29I4N?

The EP2AGZ350FH29I4N positions itself as a high-density, industrial-grade FPGA from Intel’s Arria II GZ family, offering a balance of large logic capacity, significant embedded memory, and extensive I/O in a compact BGA package. It is suited to designers who need a programmable, scalable platform for complex digital functions in industrial applications.

With documented device family specifications covering electrical characteristics, transceiver performance, and I/O timing, this FPGA provides a solid foundation for designs that require predictable operating conditions and long-term availability from a major semiconductor manufacturer.

Request a quote or submit an inquiry for availability and pricing to begin integrating the EP2AGZ350FH29I4N into your next design.