EP2AGZ350FH29I3G

The EP2AGZ350FH29I3G is an Intel Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded applications. It delivers high-density programmable logic, substantial on-chip memory, and a large I/O count in a 780-ball FCBGA package suitable for surface-mount assembly.

With 348,500 logic elements, approximately 21.27 Mbits of embedded RAM, and 281 I/O pins, this device targets systems requiring complex logic integration, significant local memory, and broad external connectivity while operating across a wide industrial temperature range.

Key Features

• Logic Capacity  348,500 logic elements organized across 13,940 LABs to support complex programmable logic implementations.
• Embedded Memory  Approximately 21.27 Mbits of on-chip RAM for buffering, LUT storage, and data-path acceleration without relying on external memory.
• I/O  281 general-purpose I/O pins to support dense peripheral interfacing and multiple parallel interfaces.
• Package and Mounting  780-ball FCBGA (supplier device package: 780-HBGA, 33×33 footprint) designed for surface-mount assembly in compact board layouts.
• Power Supply  Operates from a core voltage range of 870 mV to 930 mV to match system power planning and low-voltage designs.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Automation  Implements motor control logic, sensor aggregation, and deterministic I/O handling in industrial control systems leveraging its industrial temperature rating and high I/O count.
• Communications Infrastructure  Serves as protocol processing and custom packet-handling logic where high logic density and on-chip memory reduce external component needs.
• Embedded Systems & Prototyping  Enables system-level prototyping and embedded compute offload with substantial programmable resources and flexible I/O options.

Unique Advantages

• High logic density: 348,500 logic elements provide the resources needed to consolidate multiple functions into a single device, reducing system complexity.
• Substantial embedded memory: Approximately 21.27 Mbits of on-chip RAM supports local buffering and accelerates data-path operations without additional external memory.
• Extensive I/O: 281 I/Os allow flexible interfacing to sensors, transceivers, and peripheral devices, simplifying board-level routing and integration.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployments in temperature-challenging environments common to industrial systems.
• Compact surface-mount package: 780-ball FCBGA (33×33) supports high-density PCB designs while maintaining reliable soldered connections.
• RoHS compliant: Meets material compliance requirements for modern electronics production.

Why Choose EP2AGZ350FH29I3G?

The EP2AGZ350FH29I3G positions itself as a high-capacity, industrial-grade FPGA option for designers needing a combination of large programmable logic resources, significant on-chip memory, and broad I/O in a compact surface-mount package. Its electrical and thermal operating specifications make it suitable for embedded and industrial systems that require reliable, long-term operation.

This device is well suited for teams consolidating multiple functions into a single FPGA, reducing board-level BOM and improving integration. The combination of logic elements, embedded RAM, and I/O flexibility provides a scalable platform for complex custom logic, protocol handling, and embedded processing tasks.

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