EP2AGZ350FH29C4G

The EP2AGZ350FH29C4G is an Intel Field Programmable Gate Array (FPGA) IC in a high-density FCBGA package. It provides substantial on-chip resources for implementing custom digital logic, including a large number of logic elements, significant embedded RAM, and a wide I/O complement.

Targeted at commercial-grade electronic designs, the device offers a balance of integration and I/O capacity while operating across a typical commercial temperature range and a defined core supply voltage window.

Key Features

• Logic Capacity  Approximately 348,500 logic elements to implement complex custom logic and parallel processing functions.
• Embedded Memory  Approximately 21.27 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Count  281 user I/O pins to support multiple interfaces and peripheral connections.
• Package  780-ball FCBGA / HBGA package (780-HBGA, 33×33) optimized for high-density board integration and surface-mount assembly.
• Power Supply Range  Core voltage specified from 870 mV to 930 mV to match target system power architectures.
• Operating Temperature  Commercial operating range of 0 °C to 85 °C for room-temperature and general-purpose environments.
• Mounting & Compliance  Surface-mount device with RoHS compliance for standard lead-free assembly and environmental requirements.

Typical Applications

• Custom Digital Logic  Use the 348,500 logic elements to implement user-defined state machines, data processing pipelines, and parallel compute blocks.
• Embedded Memory-Dependent Functions  Leverage approximately 21.27 Mbits of on-chip RAM for buffering, FIFOs, and lookup tables without relying solely on external memory.
• I/O-Intensive Designs  Support multiple external interfaces and peripheral signals using the device's 281 I/O pins for flexible system connectivity.

Unique Advantages

• High Logic Density:  A large logic element count enables complex designs and higher levels of integration, reducing the need for multiple devices.
• Significant On-Chip Memory:  Approximately 21.27 Mbits of embedded RAM reduces external memory dependency and streamlines board-level BOM.
• Generous I/O Resources:  281 I/O pins support diverse connectivity and multiple parallel interfaces on a single device.
• Compact BGA Package:  780-ball FCBGA/HBGA package provides a compact footprint for space-constrained PCBs while supporting high pin counts.
• Commercial Temperature Rating:  Rated 0 °C to 85 °C for general-purpose commercial applications and standard operating environments.
• RoHS Compliant:  Meets RoHS requirements for lead-free assembly and environmental compliance.

Why Choose EP2AGZ350FH29C4G?

The EP2AGZ350FH29C4G delivers a high-density FPGA option with a substantial number of logic elements, significant embedded memory, and extensive I/O — all in a compact 780-ball BGA package. It is well suited for commercial designs that require integrated digital logic, on-chip buffering, and multiple external interfaces within a surface-mount form factor.

Designed for engineers and procurement teams seeking a balance of integration and connectivity, this device offers clear, verifiable specifications for voltage, temperature, package, and resource counts that support scalable, reliable design decisions.

Request a quote or submit a procurement inquiry to receive pricing and availability for EP2AGZ350FH29C4G.