EP2AGZ350FH29I4G

The EP2AGZ350FH29I4G is an Intel Field Programmable Gate Array (FPGA) IC designed for industrial applications that require reprogrammable digital logic. It combines high logic capacity with ample embedded memory and a large I/O count to support complex, configurable designs.

Key attributes include 348,500 logic elements, approximately 21 Mbits of embedded memory, 281 user I/Os, a compact 780-HBGA (33×33) package, low-voltage operation between 870 mV and 930 mV, and an industrial operating temperature range of −40°C to 100°C.

Key Features

• Core — Logic Capacity 348,500 logic elements provide high-density programmable logic for complex digital functions and custom data-path implementations.
• Memory Approximately 21 Mbits of on-chip RAM, enabling large buffering, local data storage, and embedded memory-intensive functions without external memory.
• I/O 281 available I/Os to support wide parallel interfaces, multiple peripherals, and flexible board-level connectivity.
• Package & Mounting Supplied in a 780-HBGA (33×33) package (780-BBGA, FCBGA family) with surface-mount mounting for compact, high-density board designs.
• Power Operates from a core voltage supply range of 870 mV to 930 mV to match low-voltage system designs.
• Temperature & Reliability Industrial temperature rating from −40°C to 100°C for deployment in demanding environments.
• Compliance RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• Industrial Automation Reprogrammable logic and high I/O count make the device suitable for motor control, machine vision pre-processing, and custom control logic in industrial systems.
• Communications Infrastructure High logic density and substantial embedded memory support packet processing, protocol bridging, and custom interface implementations.
• Test & Measurement Equipment On-chip RAM and flexible I/O enable real-time signal conditioning, capture, and custom processing in instrumentation platforms.

Unique Advantages

• High-density programmable logic: 348,500 logic elements provide the resources to implement complex control, signal processing, and data-path designs without external ASICs.
• Significant embedded memory: Approximately 21 Mbits of on-chip RAM reduces dependence on external memory for buffering and local storage, simplifying BOM and board layout.
• Wide I/O capability: 281 I/Os offer the flexibility to interface multiple sensors, peripherals, and high-pin-count connectors directly to the FPGA.
• Compact BGA package: 780-HBGA (33×33) packaging supports high-density PCB designs while maintaining a robust, surface-mount footprint.
• Industrial temperature rating: −40°C to 100°C operation ensures reliability in challenging environments and extended temperature deployments.
• Low-voltage core operation: 870 mV to 930 mV core supply supports modern low-voltage system architectures and power-optimized designs.

Why Choose EP2AGZ350FH29I4G?

The EP2AGZ350FH29I4G is positioned for industrial-grade applications that require a balance of high logic density, substantial embedded memory, and flexible I/O in a compact BGA package. Its combination of 348,500 logic elements, approximately 21 Mbits of on-chip RAM, and 281 I/Os provides a capable platform for complex, reprogrammable designs.

Engineers and procurement teams seeking a robust FPGA solution for industrial controls, communications equipment, or test systems will find this device suitable for designs that demand programmability, on-chip resources, and an extended operating temperature range.

Request a quote or submit a pricing inquiry to check availability and integrate the EP2AGZ350FH29I4G into your next industrial design.