EP2AGX95EF35C5N

The EP2AGX95EF35C5N is an Intel Arria II GX field programmable gate array (FPGA) provided in a high-pin-count 1152-BBGA (35×35) FCBGA package for surface-mount applications. It delivers a large logic fabric and embedded memory budget tailored for I/O‑dense and memory‑assisted programmable logic designs.

This commercial‑grade device is suitable for designs that require substantial logic capacity, significant on‑chip RAM, and a high number of I/O signals within a single, compact package. Electrical characteristics and switching behavior are defined in the Arria II device handbook for the family.

Key Features

• Logic Capacity — 89,178 logic elements providing programmable logic resources for complex digital functions. The device includes 3,747 logic array blocks as part of its internal architecture.
• Embedded Memory — Approximately 6.84 Mbits of on‑chip RAM to support buffering, frame storage, and local data processing without immediate external memory access.
• I/O Resources — 452 configurable I/O pins to support dense peripheral, sensor, and interface routing requirements.
• Power Requirements — Core voltage supply range from 0.870 V to 0.930 V, enabling predictable power planning and supply design.
• Package & Mounting — 1152‑FBGA (35×35) FCBGA package in a surface‑mount form factor for compact board integration and high interconnect density.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance — RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• I/O‑Intensive Systems — Leverage 452 I/O pins to interface with multiple peripherals, sensors, and external buses in a single device.
• Complex Digital Processing — Use the 89,178 logic elements to implement custom datapaths, protocol engines, and control logic.
• Embedded Memory‑Assisted Functions — Employ approximately 6.84 Mbits of on‑chip RAM for buffering, local storage, and intermediate data handling.
• Compact, High‑Density Boards — The 1152‑BBGA FCBGA surface‑mount package enables dense PCB layouts where board area and pin count are critical.

Unique Advantages

• Substantial Logic Resources: 89,178 logic elements give designers flexibility to consolidate multiple logic functions into one programmable device, reducing BOM complexity.
• Significant On‑Chip Memory: Approximately 6.84 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks, simplifying board design.
• High I/O Density: 452 I/O pins support extensive connectivity and signal partitioning without requiring multiple devices.
• Compact High‑Pin Package: The 1152‑BBGA (35×35) FCBGA package provides a small footprint with high interconnect count, suitable for tightly constrained system layouts.
• Predictable Power Envelope: A defined core voltage range (0.870 V–0.930 V) assists in power supply design and thermal planning for system integrators.
• RoHS Compliant: Meets common environmental directives for lead‑free assembly and global manufacturing requirements.

Why Choose EP2AGX95EF35C5N?

The EP2AGX95EF35C5N balances a high logic element count, meaningful on‑chip memory, and a large I/O complement in a compact 1152‑BBGA FCBGA package. Its commercial operating range and RoHS compliance make it suitable for a wide range of production environments where consolidation of digital functions and high I/O counts are priorities.

Designers and system integrators seeking a programmable device with substantial local memory and interface capacity will find this Arria II GX device appropriate for consolidating complex logic, buffering, and I/O tasks into a single FPGA footprint, supporting scalable and maintainable hardware designs.

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