EP2AGX95EF35C4N

The EP2AGX95EF35C4N is a commercial-grade Arria II GX field programmable gate array (FPGA) featuring 89,178 logic elements and substantial on-chip memory. Its combination of dense logic, plentiful I/O, and a compact 1152-BBGA FCBGA package makes it suited for space-constrained, performance-focused board designs.

Designed for applications that require high logic count and flexible I/O, this device targets communication, signal processing, and embedded system designs where integration and board-level density are priorities.

Key Features

• High Logic Density  Approximately 89,178 logic elements provide substantial programmable fabric for complex custom logic and control implementations.
• Embedded Memory  Approximately 6.84 Mbits of on-chip RAM to support data buffering, state storage, and intermediate processing without external memory dependency.
• Abundant I/O  452 general-purpose I/O pins accommodate wide parallel interfaces, multiple peripherals, and extensive board-level connectivity.
• Compact FCBGA Package  1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for high-density PCB designs.
• Core Voltage Range  Operates with a core supply range of 870 mV to 930 mV, enabling designs that follow the specified FPGA core power envelope.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation and supplied as a commercial-grade device.
• RoHS Compliant  Meets RoHS requirements for lead-free assembly and regulatory compliance in applicable regions.

Typical Applications

• Network and Communications Modules  Use the device’s large logic capacity and extensive I/O to implement packet processing, protocol bridging, and custom interface logic.
• Signal Processing and DSP  Embedded memory and abundant logic elements enable buffering, filtering, and custom datapath implementations for real-time processing tasks.
• Embedded Control Systems  High I/O count and programmable logic make it suitable for complex control, monitoring, and coordination functions in embedded platforms.
• Prototyping and Custom SoC Integration  Deploy the FPGA as a development or integration platform where dense logic and on-chip RAM simplify prototyping of custom silicon functions.

Unique Advantages

• Large Programmable Fabric:  Nearly 90k logic elements allow implementation of substantial custom logic without immediate reliance on external ASICs.
• On-Chip Memory for Reduced BOM:  Approximately 6.84 Mbits of embedded RAM lowers dependence on external memory components, simplifying BOM and board layout.
• High I/O Capacity:  452 I/O pins support multiple parallel interfaces and mixed-signal front-ends, enabling flexible system partitioning.
• Dense, Surface-Mount Package:  1152-BBGA (FCBGA) package provides a high-density mounting solution for compact, multi-layer PCBs.
• Commercial Temperature Rating:  Specified 0 °C to 85 °C range aligns with standard commercial deployments and system-level thermal designs.
• Regulatory Compliance:  RoHS compliance supports lead-free manufacturing processes and regional regulatory needs.

Why Choose EP2AGX95EF35C4N?

The EP2AGX95EF35C4N positions itself as a high-density, commercially rated FPGA option for designs that need a balance of large programmable logic, substantial embedded memory, and a high I/O count in a compact FCBGA package. Its specifications make it appropriate for system designers building communication modules, signal processing engines, and embedded controllers where board space and integration matter.

Choosing this device provides scalability for complex designs that require significant on-chip resources while keeping the BOM and external component count manageable. The commercial-grade rating and RoHS compliance support typical production environments and assembly processes.

If you would like pricing information, availability, or to request a formal quote for EP2AGX95EF35C4N, submit an inquiry or request a quote and our sales team will respond with next steps.