EP2AGX95EF29I5G

The EP2AGX95EF29I5G is an Arria II GX field programmable gate array (FPGA) in a 780-FBGA (29×29) FCBGA package designed for industrial-grade applications. It integrates 89,178 logic elements, approximately 6.84 Mbits of embedded memory, and up to 372 user I/O pins to support complex, board-level programmable logic implementations.

With validated operating ranges and RoHS compliance, this device is targeted at designs that require high on-chip logic capacity, substantial embedded RAM, and broad I/O connectivity within a surface-mount BGA package.

Key Features

• Logic Capacity — 89,178 logic elements provide the programmable logic resources for complex custom logic, state machines, and datapath implementations.
• Embedded Memory — Approximately 6.84 Mbits of total on-chip RAM for FIFOs, buffers, and distributed storage within the FPGA fabric.
• I/O Connectivity — Up to 372 user I/O pins to support wide parallel interfaces, high pin-count peripherals, and flexible board-level connectivity.
• Package and Mounting — 780-FBGA (29×29) FCBGA package in a surface-mount form factor for compact PCB integration.
• Power Supply Range — Core voltage supply range of 870 mV to 930 mV to match system power rails and regulator designs.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
• Compliance — RoHS compliant for environmental and regulatory conformity.

Typical Applications

• Industrial Control Systems — Use the device’s logic and embedded RAM to implement motion-control logic, signal conditioning, and deterministic I/O handling across wide temperature ranges.
• Communications and Networking — 372 I/Os and large logic capacity make the device suitable for protocol bridging, packet processing engines, and custom interface logic.
• High-Density Board-Level Integration — The 780-FBGA package and surface-mount footprint enable compact designs that require significant on-chip logic and memory without external FPGA peripherals.

Unique Advantages

• Substantial On-Chip Resources: 89,178 logic elements combined with approximately 6.84 Mbits of embedded RAM allow consolidation of complex subsystems into a single device, reducing external component count.
• Broad I/O Count: Up to 372 I/Os provide flexibility for parallel interfaces, multi-channel I/O, and high-pin-count peripheral connectivity.
• Industrial-Grade Temperature Range: Operation from −40 °C to 100 °C supports deployments in demanding environmental conditions.
• Compact BGA Packaging: The 780-FBGA (29×29) FCBGA package and surface-mount mounting simplify PCB layout for space-constrained systems.
• Controlled Core Voltage Window: A defined core supply range (870 mV–930 mV) helps with power budgeting and regulator selection for reliable system integration.
• Regulatory Compliance: RoHS compliance supports environmental requirements and simplifies global sourcing.

Why Choose EP2AGX95EF29I5G?

The EP2AGX95EF29I5G delivers a balanced combination of large programmable-logic capacity, meaningful on-chip memory, and extensive I/O in an industrial-temperature FPGA. Its FCBGA package and surface-mount form factor make it a practical choice for compact, high-density circuit board designs where on-chip integration reduces external components and simplifies system architecture.

Engineers selecting this device will benefit from deterministic electrical and thermal specification windows—such as the defined core voltage range and industrial operating temperature—making it well suited for long-life industrial applications and complex embedded systems that require reliable programmable logic resources.

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