EP2AGX95EF29I3N

The EP2AGX95EF29I3N is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It delivers substantial logic capacity and on‑chip memory in a compact, surface‑mount package intended for industrial applications.

With 89,178 logic elements, approximately 6.84 Mbits of embedded memory, and 372 user I/Os, this device targets designs that require dense programmable logic, significant embedded RAM, and a high I/O count while operating across a wide industrial temperature range.

Key Features

• Logic Capacity — 89,178 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory — Approximately 6.84 Mbits of on‑chip RAM for buffering, look‑up tables, and local storage.
• I/O Density — 372 user I/O pins to support high‑pin‑count interfaces and multi‑channel connectivity.
• Power Supply — Core voltage range of 870 mV to 930 mV for the device core and internal circuitry.
• Operating Temperature — Industrial temperature grade with rated operation from −40°C to 100°C for robust field performance.
• Package & Mounting — 780‑FBGA (29×29) FCBGA surface‑mount package for compact board integration.
• RoHS Compliant — Meets RoHS requirements for lead‑free assemblies.

Typical Applications

• Industrial Control — Use the device’s industrial temperature rating and high I/O count to interface sensors, actuators, and control buses in factory and process automation.
• Custom Logic Acceleration — Deploy the large logic element count and embedded RAM to accelerate application‑specific datapaths and offload tasks from general‑purpose processors.
• High‑Density I/O Systems — Leverage 372 I/Os for multi‑channel data acquisition, protocol bridging, and system orchestration where many external signals are required.

Unique Advantages

• High integration density: Combines 89,178 logic elements and approximately 6.84 Mbits of embedded memory in a single FPGA to reduce external components and board area.
• Robust industrial operation: Rated for −40°C to 100°C, supporting deployments in temperature‑challenging environments.
• High I/O capacity: 372 user I/Os simplify board design for multi‑interface and multi‑channel systems, reducing the need for external multiplexing.
• Compact package footprint: 780‑FBGA (29×29) surface‑mount package enables dense PCB layouts while maintaining accessibility to high pin counts.
• Low‑voltage core operation: Core supply from 870 mV to 930 mV supports modern low‑voltage power domains.
• Standards‑aware documentation: Device is part of the Arria II family with published device handbook and datasheet material for design reference.

Why Choose EP2AGX95EF29I3N?

The EP2AGX95EF29I3N positions itself as a high‑density, industrial‑grade FPGA that balances extensive logic resources, substantial embedded memory, and a large I/O complement in a compact FCBGA package. These attributes make it suitable for engineers needing a single‑chip platform to consolidate logic functions, manage multi‑channel I/O, and operate reliably across a broad temperature range.

Backed by Arria II family documentation, the device is appropriate for design teams focused on scalable, rugged solutions where integration density and I/O capacity drive board‑level simplification and system reliability.

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