EP2AGX95EF29C6NGA

The EP2AGX95EF29C6NGA is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It provides a large logic fabric and embedded memory for configurable digital designs, along with abundant I/O and a compact surface-mount package suitable for commercial embedded applications.

Key value lies in its combination of 89,178 logic elements, approximately 6.84 Mbits of on-chip RAM, and 372 user I/O pins, enabling complex logic integration, memory-intensive processing, and broad external interfacing within a single device footprint.

Key Features

• Core Logic Capacity — 89,178 logic elements to implement substantial custom digital logic and state machines.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM (6,839,296 bits) to support buffering, FIFOs, and memory-intensive functions.
• I/O Density — 372 user I/O pins to connect multiple peripherals, buses, and external devices directly to the FPGA fabric.
• Package and Mounting — Supplied in a 780-BBGA, FCBGA package; supplier device package listed as 780-FBGA (29×29). Surface mount device simplifies board-level integration.
• Power — Core voltage supply range of 870 mV to 930 mV for the device core powering requirements.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Complex digital logic implementations — Use the 89,178 logic elements to realize large state machines, protocol engines, and custom datapaths.
• Memory-intensive processing — Leverage approximately 6.84 Mbits of embedded RAM for buffering, packet memory, and on-chip data storage.
• I/O interfacing and bridging — 372 I/O pins enable wide parallel interfaces, multiple serial lives, or protocol bridging between subsystems.
• Commercial embedded systems — Commercial temperature range (0 °C to 85 °C) and surface-mount package fit embedded product requirements where commercial-grade specifications are acceptable.

Unique Advantages

• High logic density: 89,178 logic elements allow substantial functionality integration without multiple devices.
• Significant on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces dependence on external memory for many applications.
• Extensive I/O: 372 user I/O pins support complex, multi-interface designs and minimize external glue logic.
• Compact BGA package: 780-ball FCBGA (29×29) balances I/O count and board-area efficiency for space-constrained designs.
• Low-voltage core: Core supply range of 870 mV–930 mV aligns with modern power-optimized system designs.
• RoHS compliant: Meets lead-free materials requirements for environmental and manufacturing standards.

Why Choose EP2AGX95EF29C6NGA?

The EP2AGX95EF29C6NGA positions itself for designers who need a high-capacity FPGA with substantial embedded memory and a large number of I/O in a compact surface-mount BGA package. Its commercial temperature rating and RoHS compliance make it suitable for a broad range of embedded applications that require integrated logic, on-chip RAM, and flexible interfacing.

For teams building prototypes or production systems that benefit from on-device memory and dense logic resources, this Arria II GX device offers a scalable platform that consolidates functions, reduces board-level complexity, and supports efficient power delivery with its specified core voltage range.

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