EP2AGX95EF29I3G

The EP2AGX95EF29I3G is an Intel Arria II GX Field Programmable Gate Array supplied in a 780‑ball FCBGA package (29×29). It combines a 40‑nm, low‑power FPGA engine with substantial logic and embedded memory resources targeted at high‑performance, industrial applications that require dense programmable logic, high I/O count, and compact packaging.

Designed for applications that demand flexible interface integration and on‑board signal processing, this device addresses system needs for communications, video, test and measurement, and industrial control where a robust, reconfigurable processing element is required.

Key Features

• Logic Capacity  Approximately 89,178 logic elements for implementing complex control, interface, and processing functions.
• Embedded Memory  Approximately 6.84 Mbits of on‑chip RAM to support FIFOs, packet buffering, and intermediate data storage.
• I/O and Packaging  372 user I/O in a 780‑BBGA (FCBGA) 29×29 surface‑mount package for high‑density board integration.
• Core Power  Core voltage supply range of 870 mV to 930 mV to match system power rails and enable optimized power budgets.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Arria II Family Capabilities  As part of the Arria II device family, the architecture includes a 40‑nm low‑power FPGA engine, adaptive logic modules (ALMs), eight‑input fracturable LUTs, and rich DSP resources.
• DSP and Multiply Options  Family DSP blocks capable of high‑performance arithmetic functions and configurable multipliers to support signal processing tasks.
• High‑Speed Serial and Protocol Support (Family)  Arria II family devices provide integrated transceiver support and protocol‑oriented hard IP for applications requiring PCIe, Ethernet, DDR3 memory interfaces, and other serial standards.
• Security and Configuration (Family)  Family features include advanced configuration options and design security mechanisms such as AES programming file encryption and on‑chip key storage.
• Compliance  RoHS‑compliant device and surface‑mount package suitable for modern manufacturing processes.

Typical Applications

• High‑Speed Communications  Ideal for protocol bridging, packet processing, and line‑card logic where programmable transceiver and logic resources enable flexible interface implementation.
• Video and Broadcast Processing  Used for video transport, formatting, and buffering where on‑chip RAM and DSP resources accelerate streaming and real‑time processing.
• Industrial Control and Automation  Deploy for motor control, sensor aggregation, and deterministic I/O handling that benefit from the device’s industrial temperature rating and dense logic.
• Test & Measurement  Suitable for front‑end data capture, FPGA‑based instrumentation, and protocol analysis leveraging abundant logic and embedded memory.

Unique Advantages

• High Logic Density: Large logic element count enables consolidation of multiple functions into a single FPGA, reducing board complexity.
• Significant On‑Chip Memory: Approximately 6.84 Mbits of embedded RAM supports buffering, streaming, and packet handling without external memory.
• Industrial Temperature Rating: Specified −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact, High‑Density Package: 780‑ball FCBGA (29×29) surface‑mount package provides a balance of I/O capacity and PCB footprint efficiency.
• Low‑Voltage Core Operation: 870–930 mV core supply enables integration into modern low‑voltage power architectures.
• Arria II Family Integration: Family features such as ALMs, configurable DSP blocks, and transceiver hard IP simplify implementation of common interfaces and signal‑processing tasks.

Why Choose EP2AGX95EF29I3G?

The EP2AGX95EF29I3G delivers a balance of high logic capacity, substantial embedded memory, and a compact FCBGA package tailored for industrial applications. Its 40‑nm Arria II family architecture brings adaptive logic modules, DSP capabilities, and family‑level transceiver and protocol support that streamline system integration for communications, video, and industrial control designs.

This device is suited to engineers and system designers who need a reconfigurable, high‑density solution that operates across an extended temperature range, supports surface‑mount board assembly, and aligns with RoHS manufacturing requirements. Its combination of resources provides long‑term value through design flexibility and compatibility with Arria II family features.

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