EP2AGX95EF29C6G

The EP2AGX95EF29C6G is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780-ball fine-pitch BGA (29 × 29) surface-mount package. It delivers a large programmable fabric and a substantial number of I/O pins for designs that require dense logic, significant on-chip memory, and extensive connectivity.

With 89,178 logic elements and approximately 6.8 Mbits of embedded memory, this commercial-grade device targets applications that benefit from high logic capacity, high I/O count, and low-voltage operation within a compact package.

Key Features

• Logic Capacity  Provides 89,178 logic elements to implement complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 6.8 Mbits of on-chip RAM for data buffering, state machines, and local storage.
• I/O Resources  372 user I/O pins to support wide parallel interfaces, multiple peripherals, and board-level interconnects.
• Power  Operates from a core voltage supply range of 870 mV to 930 mV to match system power rails and design constraints.
• Package & Mounting  780-BBGA (FCBGA) in a 29 × 29 format, surface-mountable for compact PCB designs.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• High-density I/O systems  Use the 372 I/O pins to interface with multiple high-pin-count peripherals, parallel buses, or board-level connectors.
• Custom logic and protocol bridging  Leverage the large logic element count to implement protocol translators, custom datapaths, and glue logic.
• On-chip buffering and state machines  Utilize approximately 6.8 Mbits of embedded RAM for buffering, FIFOs, and control storage in data-flow designs.

Unique Advantages

• High logic density: 89,178 logic elements enable implementation of sizeable custom logic functions without external ASICs or discrete gate arrays.
• Substantial embedded memory: Approximately 6.8 Mbits of on-chip RAM reduces reliance on external memory for many buffering and temporary storage needs.
• Extensive I/O: 372 I/O pins provide flexibility for multi-interface designs and complex interconnect requirements.
• Compact surface-mount package: 780-BBGA (29 × 29) footprint supports space-constrained PCB layouts while maintaining high pin count.
• Low-voltage core operation: Core supply range of 870 mV to 930 mV supports integration with modern low-voltage power architectures.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product lifecycles.

Why Choose EP2AGX95EF29C6G?

The EP2AGX95EF29C6G positions itself as a balanced solution for designers needing a high number of logic elements, generous on-chip memory, and a large I/O count in a compact FCBGA package. Its combination of resources makes it appropriate for complex digital designs that require significant programmable logic and local memory while conforming to commercial temperature ranges.

Choose this device when you need a programmable, high-density logic platform that integrates substantial embedded RAM and extensive connectivity in a surface-mount BGA package—offering a scalable option for a range of mid- to high-complexity FPGA implementations.

Request a quote or submit a pricing inquiry today to get availability and lead-time information for EP2AGX95EF29C6G.