EP2AGX95EF29C6

The EP2AGX95EF29C6 is an Intel Arria II GX field programmable gate array in a 780-BBGA FCBGA package. It provides a high-density, programmable logic fabric intended for designs that require substantial logic capacity, embedded memory, and a large I/O count.

This commercial‑grade device is specified with a core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C. The device datasheet for the Arria II family documents electrical characteristics, transceiver performance specifications, and I/O timing for the GX series.

Key Features

• Logic Capacity — 89,178 logic elements (cells) provide significant programmable logic resources for complex designs.
• Embedded Memory — Approximately 6.84 Mbits of on‑chip RAM to support buffers, FIFOs, and local data storage.
• I/O Resources — 372 user I/O pins to support multi‑lane interfaces and numerous peripheral connections.
• Package and Mounting — 780‑BBGA (FCBGA) with supplier device package 780‑FBGA (29×29), designed for surface‑mount assembly.
• Power — Core voltage supply range of 870 mV to 930 mV for the device core and periphery.
• Commercial Grade — Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Series-Level Documentation — Arria II device handbook includes electrical characteristics, transceiver performance specifications, and I/O timing information relevant to Arria II GX devices.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density logic integration — Use the device where large numbers of programmable logic elements and embedded memory are needed to implement complex state machines, packet processing, or acceleration functions.
• Interface aggregation and bridging — 372 I/O pins support designs that consolidate multiple peripheral interfaces or implement custom I/O routing and protocol bridging.
• Communications and transceiver‑enabled designs — As part of the Arria II GX family, the device is supported by series documentation covering transceiver performance and I/O timing, useful for communication link implementations.

Unique Advantages

• Substantial logic density: 89,178 logic elements enable complex digital designs without immediate need for external logic expansion.
• On‑chip memory resources: Approximately 6.84 Mbits of embedded RAM reduce dependence on external memory for intermediate storage and buffering.
• High I/O count: 372 I/O pins simplify board routing for multiport designs and reduce the need for external I/O expanders.
• Compact FBGA package: 780‑FBGA (29×29) delivers a high pin count in a surface‑mount footprint suitable for dense board layouts.
• Commercial operating range: Specified for 0 °C to 85 °C, matching many standard electronics applications and deployment environments.
• Compliance and documentation: RoHS compliance and Arria II GX family documentation provide clear electrical and timing references for system integration.

Why Choose EP2AGX95EF29C6?

The EP2AGX95EF29C6 positions itself as a high‑capacity, commercial‑grade Arria II GX FPGA that combines large logic resources, substantial embedded memory, and a high I/O count in a 780‑BBGA FCBGA package. Its documented series characteristics for electrical behavior, transceiver performance, and I/O timing support engineers integrating the part into communication, processing, and interface‑dense designs.

This device is well suited to teams and projects that require scalable logic capacity with on‑chip memory and extensive I/O in a surface‑mount FBGA package, backed by Arria II series documentation and RoHS compliance.

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