EP2AGX95EF29C4N

The EP2AGX95EF29C4N is an Intel Arria II GX Field Programmable Gate Array (FPGA) in a 780‑ball FCBGA surface‑mount package. This commercial‑grade FPGA supplies a balance of logic capacity, on‑chip memory, and I/O density for programmable digital designs.

Designed for system and board‑level integration, the device targets applications that require substantial logic resources, embedded memory, and a high count of I/O within a compact 29×29 mm package footprint.

Key Features

• Logic Capacity — 89,178 logic elements (cells) to implement complex custom logic and control functions.
• Embedded Memory — Approximately 6.84 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 372 I/O pins to support dense board‑level connectivity and multiple parallel interfaces.
• Power Supply — Core supply range specified at 870 mV to 930 mV to match system power‑rail requirements.
• Package & Mounting — 780‑BBGA (FCBGA) supplier package: 780‑FBGA (29×29), surface mount for compact PCB integration.
• Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Programmable logic and prototyping — Use the device’s 89,178 logic elements for custom digital logic, control functions, and hardware prototyping.
• Memory‑intensive designs — Approximately 6.84 Mbits of embedded memory supports buffering, packet processing, and local data storage.
• I/O‑heavy systems — 372 I/O pins enable parallel interfaces, board‑level integration, and connectivity for multi‑channel designs.
• Commercial electronics — Commercial‑grade temperature range (0 °C to 85 °C) fits office, telecom, and industrial office environment deployments.

Unique Advantages

• High logic density: 89,178 logic elements allow complex functions to be consolidated into a single device, reducing system BOM and board area.
• Substantial on‑chip RAM: Approximately 6.84 Mbits of embedded memory minimizes external memory requirements for many buffering and data‑path tasks.
• High I/O count: 372 I/O pins provide flexibility for interfacing multiple peripherals, busses, and parallel data paths.
• Compact FCBGA package: The 780‑ball, 29×29 FCBGA package supports a compact PCB footprint while enabling surface‑mount assembly.
• Low‑voltage core operation: Core voltage range of 0.87 V to 0.93 V accommodates low‑voltage power architectures.
• RoHS compliant: Meets lead‑free manufacturing and environmental requirements.

Why Choose EP2AGX95EF29C4N?

The EP2AGX95EF29C4N Arria II GX FPGA combines a large logic element count, multi‑Mbit on‑chip memory, and a high I/O complement in a compact 780‑ball FCBGA package. These attributes make it well suited to systems that require consolidated programmable logic, substantial embedded memory, and dense board‑level connectivity within a commercial operating environment.

Its defined core voltage range, commercial temperature rating, and RoHS compliance provide predictable integration parameters for procurement and design teams focused on reliable, compact FPGA solutions.

Request a quote or submit an inquiry for pricing and availability of EP2AGX95EF29C4N. Our team will respond with lead‑time and ordering details to support your design schedule.