EP2AGX95DF25I5N

The EP2AGX95DF25I5N is an Arria II GX Field Programmable Gate Array (FPGA) in a 572-FBGA surface-mount package. It provides a substantial array of programmable logic, embedded memory, and a high I/O count for system designs that require flexible hardware implementation.

Designed for industrial-grade operation, this device combines large logic capacity and on-chip RAM with a compact 572-ball FCBGA footprint, making it suitable for systems that need a blend of integration density and robust temperature tolerance.

Key Features

• Logic Capacity — 89,178 logic elements (cells) to implement complex digital functions and custom hardware accelerators.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for data buffering, state storage, and local memory needs.
• I/O Density — 260 user I/Os to support wide parallel interfaces and multiple peripheral connections.
• Package & Mounting — 572-ball FCBGA (572-FBGA, FC 25×25) surface-mount package for compact board-level integration.
• Power Supply — Core voltage supply range of 0.870 V to 0.930 V to match system power domains and design choices.
• Industrial Temperature Grade — Rated for operation from −40°C to 100°C to meet demanding environmental conditions.
• RoHS Compliance — Device is RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• Industrial Control — Leverage the industrial temperature rating and high I/O count for factory automation, motor control interfaces, and machine-vision preprocessing.
• Embedded Systems — Implement custom data-paths, protocol handling, and hardware accelerators using the large logic array and on-chip RAM.
• Communications & Networking — Use the device’s abundant logic and I/O resources for packet processing, protocol bridging, and interface adaptation in networking equipment.

Unique Advantages

• High logic density: 89,178 logic elements enable implementation of large-scale custom logic and multiple concurrent functions on a single device.
• Substantial embedded memory: Approximately 6.84 Mbits of on-chip RAM reduces external memory dependency and accelerates local data handling.
• Extensive I/O connectivity: 260 I/Os allow broad peripheral and bus support without immediate need for external I/O expanders.
• Industrial operating range: −40°C to 100°C supports deployment in thermally challenging environments.
• Compact, board-ready package: 572-FBGA (25×25) surface-mount footprint balances integration density with manufacturability.
• Low-voltage core operation: 0.870–0.930 V core supply supports designs targeting low-voltage power domains.

Why Choose EP2AGX95DF25I5N?

The EP2AGX95DF25I5N positions itself as a versatile Arria II GX FPGA option for designs that require a high count of logic elements, significant on-chip memory, and a large number of I/Os within a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life deployments where environmental robustness and regulatory alignment matter.

This device is well suited to engineering teams building embedded systems, industrial controllers, or communications equipment that need a balance of integration density, predictable power requirements, and a compact form factor.

Request a quote or submit your RFQ to evaluate EP2AGX95DF25I5N availability and pricing for your next design.