EP2AGX95DF25I5

The EP2AGX95DF25I5 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 572-ball FCBGA package and rated for industrial operation. It delivers a high logic element count and substantial on-chip RAM to support complex, configurable digital designs.

Targeted at industrial and embedded applications, this device combines a large number of logic elements, approximately 6.84 Mbits of embedded memory, and 260 I/O to enable applications that require dense, reconfigurable logic, deterministic I/O, and operation across a wide temperature range.

Key Features

• Core and Logic  Approximately 89,178 logic elements for implementing dense digital logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 6.84 Mbits of embedded memory (6,839,296 total RAM bits) to support data buffering, FIFOs, and on-chip storage for algorithms.
• I/O  260 general-purpose I/O pins to interface with peripherals, sensors, and external memory or logic devices; I/O timing and programmable delays are documented in the device datasheet.
• Power Domain  Core voltage supply specified at 870 mV to 930 mV, enabling precise power budgeting for the core domain.
• Package & Mounting  572-ball FCBGA (572-FBGA, FC, 25×25) in a surface-mount package for compact board integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
• Standards & Compliance  RoHS compliant to support environmental regulatory requirements.
• Documentation  Arria II device handbook and device datasheet include detailed electrical characteristics, transceiver performance specifications, and I/O timing guidance for system design.

Typical Applications

• Industrial Control and Automation  Industrial-grade temperature rating and substantial logic resources make this FPGA suitable for motor control, PLC functions, and factory automation systems.
• High-speed Communications  Designed for applications leveraging Arria II GX device family transceiver and I/O capabilities as documented in the device datasheet for protocol bridging and data transport.
• Signal Processing and Protocol Offload  Large logic capacity and embedded memory support implementation of signal processing pipelines, packet processing, and protocol engines on-chip.
• Embedded System Integration  Use as a flexible hardware platform for prototyping, custom interfaces, and combining multiple digital functions into a single, reconfigurable device.

Unique Advantages

• High Logic Density:  Nearly 89k logic elements enable complex designs and multi-function integration without excessive partitioning.
• Substantial On-chip Memory:  Approximately 6.84 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
• Industrial Reliability:  Rated for −40°C to 100°C operation and specified as industrial grade for field-deployed systems.
• Compact FCBGA Footprint:  572-ball package (25×25) allows high-density board layouts for space-constrained applications.
• Precise Power Specification:  Core supply defined at 870–930 mV for predictable power delivery and system-level budgeting.
• Regulatory Compliance:  RoHS compliance simplifies environmental qualification and procurement.

Why Choose EP2AGX95DF25I5?

The EP2AGX95DF25I5 positions itself as a robust, industrial-grade FPGA option within the Intel Arria II GX family, delivering a combination of high logic capacity, multi-megabit on-chip memory, and a generous I/O count in a compact FCBGA package. These attributes make it well suited for engineers building industrial, communications, and embedded systems that require reconfigurable logic and reliable operation across a wide temperature range.

Backed by the Arria II device handbook and device datasheet, this device offers documented electrical characteristics, I/O timing, and transceiver performance guidance to support system integration and verification activities.

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