EP2AGX95DF25I3G

The EP2AGX95DF25I3G is an Intel Arria II GX field programmable gate array (FPGA) available in a 572-ball FCBGA package. It provides a high-density programmable fabric with 89,178 logic elements and approximately 6.84 Mbits of embedded memory to implement complex digital functions.

Designed for industrial-grade applications, this surface-mount FPGA supports 260 I/O signals, operates from a 870 mV to 930 mV supply range, and is specified for an operating temperature range of -40 °C to 100 °C, offering a combination of integration and environmental robustness for demanding designs.

Key Features

• Programmable Logic Capacity — 89,178 logic elements for implementing complex custom logic, state machines, and parallel processing structures.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O Density — 260 programmable I/O pins to interface with peripherals, sensors, and high-speed external devices.
• Package — 572-ball BGA (572-FBGA, FC 25×25) in a surface-mount form factor for board-level integration and high-pin-count routing.
• Power — Operates from a supply range of 870 mV to 930 mV to match platform power architectures.
• Temperature and Grade — Industrial grade with an operating temperature range of -40 °C to 100 °C for extended-environment use.
• Environmental Compliance — RoHS compliant, aligning with lead-free manufacturing requirements.

Unique Advantages

• High logic density: 89,178 logic elements enable consolidation of multiple functions into a single device, reducing overall BOM and board area.
• Significant on-chip memory: Approximately 6.84 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks, simplifying system design.
• Generous I/O count: 260 I/O signals support complex interfacing requirements without immediate need for I/O expanders.
• Industrial temperature range: Rated from -40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact, high-pin-count package: 572-FBGA (25×25) offers high connectivity in a compact surface-mount footprint suitable for dense board layouts.
• Regulatory readiness: RoHS compliance eases integration into lead-free manufacturing flows.

Why Choose EP2AGX95DF25I3G?

The EP2AGX95DF25I3G positions itself as a high-density, industrial-grade FPGA option for designs that require substantial logic capacity, on-chip memory, and a large number of I/Os within a compact BGA package. Its specified supply range and extended operating temperature make it suitable for robust embedded and industrial applications where environmental range and integration matter.

Engineers and procurement teams looking for a scalable programmable solution with clear, verifiable hardware specifications—logic capacity, embedded RAM, I/O count, package, power, and temperature ratings—will find this device well-specified for system-level planning and long-term deployment.

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