EP2AGX95DF25C6N

The EP2AGX95DF25C6N is an Arria II GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 572-ball fine-pitch BGA (572-FBGA, 25×25) surface-mount package. It combines a large programmable fabric with substantial on-chip memory and flexible I/O counts to address designs that require significant logic capacity and embedded RAM.

With 89,178 logic elements, approximately 6.84 Mbits of embedded memory, and 260 available I/O signals, this commercial-grade FPGA is suited to applications that need programmable logic, integrated memory resources, and a high pin-count interface in a compact BGA footprint.

Key Features

• Logic Capacity — 89,178 logic elements provide extensive programmable logic resources for complex digital designs and custom logic implementation.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, FIFOs, and data-path storage without external memory dependence.
• I/O Resources & Package — 260 I/O pins in a 572-FBGA (25×25) package enable dense connectivity and multiple external interfaces while supporting surface-mount PCB assembly.
• Power Domain — Core supply range of 870 mV to 930 mV to match system power rails and core-voltage domains.
• Commercial Grade & Temperature Range — Rated for commercial operation from 0°C to 85°C for standard industrial and electronic systems.
• RoHS Compliant — Conforms to RoHS requirements for environmental and regulatory compliance.

Typical Applications

• Protocol Bridging and Packet Processing — Large logic capacity and embedded RAM make the device suitable for implementing custom packet processing, protocol conversion, and data-path acceleration.
• Custom I/O and Interface Control — With 260 I/O pins and a compact 572-FBGA package, the FPGA supports dense board-level integration for multi-interface controller roles.
• Embedded Logic and Memory-Intensive Functions — Approximately 6.84 Mbits of on-chip RAM enable buffering, lookup tables, and data staging close to the logic fabric for latency-sensitive tasks.

Unique Advantages

• High Logic Density: 89,178 logic elements provide a large, integrated fabric for complex state machines, DSP pipelines, or custom accelerators without immediate external logic.
• Substantial On-chip Memory: Approximately 6.84 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Robust I/O Count in a Compact Package: 260 I/Os in a 572-FBGA (25×25) footprint streamline multi-interface designs while conserving PCB area.
• Low-Voltage Core Operation: Core supply operation between 870 mV and 930 mV aligns with lower-voltage power domains commonly used to optimize system power budgets.
• Commercial Temperature Range: Rated 0°C to 85°C for standard commercial applications and environments.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product builds and regulatory requirements.

Why Choose EP2AGX95DF25C6N?

The EP2AGX95DF25C6N balances high logic capacity, rich embedded memory, and a high I/O count in a compact 572-FBGA package, making it a practical choice for designers implementing mid-to-high density programmable logic solutions. Its commercial-grade rating and defined operating voltage and temperature ranges provide predictable integration into standard electronic systems.

Manufactured by Intel and documented in the Arria II device family datasheets, this FPGA is appropriate for teams needing a proven programmable fabric with substantial on-chip resources and a compact board-level footprint.

Request a quote or submit a product inquiry to obtain pricing and availability for the EP2AGX95DF25C6N.