EP2AGX95DF25C5N

IC FPGA 260 I/O 572FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 260 6839296 89178 572-BGA, FCBGA

Quantity 1,147 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package572-FBGA, FC (25x25)GradeCommercialOperating Temperature0°C – 85°C
Package / Case572-BGA, FCBGANumber of I/O260Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3747Number of Logic Elements/Cells89178
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6839296

Overview of EP2AGX95DF25C5N – Arria II GX Field Programmable Gate Array (FPGA), 572-FBGA

The EP2AGX95DF25C5N is an Arria II GX family FPGA from Intel, offering a high density of programmable logic and on-chip memory in a compact 572-FBGA surface-mount package. The device combines 89,178 logic elements with approximately 6.84 Mbits of embedded RAM and 260 user I/O pins to support complex digital designs.

Designed and documented as part of the Arria II device family, device-level documentation for electrical and switching characteristics, transceiver performance, and I/O timing is available in the Arria II device handbook. The EP2AGX95DF25C5N is a commercial-grade device rated for 0 °C to 85 °C operation and is RoHS compliant.

Key Features

  • Logic Capacity — 89,178 logic elements for substantial programmable logic resources.
  • Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic.
  • I/O Resources — 260 user I/O pins to support a wide range of peripheral and interface connections.
  • Package & Mounting — 572-BGA (572-FBGA, FC 25×25) surface-mount package for high-density board integration.
  • Power — Core voltage supply range: 870 mV to 930 mV for predictable power-rail design.
  • Operating Grade & Temperature — Commercial grade with operating temperature from 0 °C to 85 °C.
  • Regulatory Compliance — RoHS compliant.
  • Documentation Coverage — Arria II device handbook includes detailed electrical characteristics, switching specifications, transceiver performance, and I/O timing guidance.

Unique Advantages

  • High integration density: Large logic element count and embedded RAM reduce dependency on external logic and memory components.
  • Extensive I/O in a compact footprint: 260 I/O in a 25×25 572-FBGA package enables dense system connections while conserving PCB area.
  • Defined power requirements: Narrow core voltage range (870–930 mV) aids in stable power-supply implementation and regulation planning.
  • Commercial-ready thermal range: Rated for 0 °C to 85 °C operation to meet mainstream commercial deployment conditions.
  • Environmentally compliant: RoHS compliance supports environmental restrictions and industry sourcing requirements.
  • Documented device behavior: Family-level handbook provides the technical detail needed for electrical and timing verification.

Why Choose EP2AGX95DF25C5N?

The EP2AGX95DF25C5N delivers a balanced combination of high logic capacity, substantial embedded memory, and abundant I/O in a compact 572-FBGA package—making it suitable for commercial FPGA designs that require significant programmable resources and board-density efficiency. Its defined core voltage range, commercial operating temperature rating, and RoHS compliance provide predictable integration parameters for procurement and design planning.

Supported by the Arria II device handbook documentation, this FPGA provides the specification-level detail engineers need for electrical validation and timing design within the Arria II family framework.

Request a quote or submit a pricing and availability inquiry for EP2AGX95DF25C5N today to receive detailed commercial terms and lead-time information.

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