EP2AGX95DF25C4N

The EP2AGX95DF25C4N is an Arria II GX family FPGA from Intel, delivered in a 572-ball FCBGA (572-FBGA, FC, 25×25) surface-mount package. It provides a high-density programmable logic fabric with a defined core voltage range and commercial-grade operating temperature for general-purpose embedded and digital designs.

With 89,178 logic elements and approximately 6.84 Mbits of embedded memory, this device targets designs that require significant on-chip logic density, multi-megabit RAM, and substantial I/O capacity while operating within a commercial temperature window.

Key Features

• Core Logic — 89,178 logic elements enable implementation of complex, custom digital logic and state machines.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM to support buffering, packet storage, and local data structures without external memory for many functions.
• I/O Capacity — 260 user I/O pins for dense external connectivity, interface bridging, and peripheral integration.
• Package & Mounting — 572-BGA FCBGA (572-FBGA, FC, 25×25) in a surface-mount form factor for compact board-level integration.
• Power — Core supply specified from 870 mV to 930 mV allowing integration into low-voltage power domains.
• Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard consumer and industrial-adjacent applications within this range.
• Standards Compliance — RoHS compliant, supporting regulatory requirements for lead-free assembly.
• Documentation — Supported by the Arria II device handbook and device datasheet material for electrical and switching characteristics and device-level guidance.

Typical Applications

• Custom Digital Logic and Prototyping — Implement complex, high-density programmable logic using 89,178 logic elements for control, signal processing, or algorithm acceleration.
• Memory-Intensive On-Chip Functions — Leverage approximately 6.84 Mbits of embedded memory for buffering, packet queues, and intermediate data storage.
• High-Connectivity Interfaces — Use 260 I/Os to connect multiple peripherals, handle parallel interfaces, or implement dense I/O routing on a single FPGA.

Unique Advantages

• High Logic Density: 89,178 logic elements allow substantial functionality to be implemented on-chip, reducing external component count.
• Multi-Megabit Embedded Memory: Approximately 6.84 Mbits of RAM supports on-chip buffering and data handling for latency-sensitive tasks.
• Generous I/O Resources: 260 I/Os simplify board-level design by enabling direct connections to multiple buses and peripherals.
• Compact, Industry-Standard Package: 572-FBGA (25×25) provides a compact surface-mount footprint suitable for space-constrained PCBs.
• Low-Voltage Core: Core supply specified between 870 mV and 930 mV for integration with modern low-voltage power domains.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing requirements.

Why Choose EP2AGX95DF25C4N?

The EP2AGX95DF25C4N positions itself as a high-density Arria II GX FPGA option for designs that require significant on-chip logic and memory alongside substantial I/O. Its combination of 89,178 logic elements, approximately 6.84 Mbits of embedded RAM, and 260 I/Os in a 572-FBGA package supports compact system integration while meeting commercial operating requirements.

Backed by the Arria II device documentation, this device is suitable for engineering teams seeking verified device-level electrical and switching characteristics, clear power and thermal boundaries, and a proven device family foundation for a range of programmable-logic implementations.

Request a quote or submit a pricing inquiry today to evaluate EP2AGX95DF25C4N for your next programmable logic design.