EP2AGX95DF25I3

The EP2AGX95DF25I3 is an Intel Arria II GX field-programmable gate array (FPGA) offered in an industrial-grade FCBGA package. It delivers a high-density logic fabric combined with sizable on-chip memory and a broad I/O count for demanding embedded and communications designs.

Designed for applications that require programmable logic, transceiver-capable I/O and extended temperature operation, this device balances integration and robustness with a low-voltage core operating range of 870 mV to 930 mV and an operating temperature range of –40°C to 100°C.

Key Features

• Core logic density  Provides 89,178 logic elements suitable for complex logic implementation and system-level integration.
• Embedded memory  Approximately 6.84 Mbits of total on-chip RAM for frame buffers, FIFOs and local data storage.
• I/O capacity  260 user I/Os for flexible board-level interfacing and high-pin-count peripheral connectivity.
• Transceiver and I/O timing  Arria II GX family device handbook describes transceiver performance and programmable I/O timing features useful for serial links and timing-critical interfaces.
• Power and core supply  Core voltage supply range of 870 mV to 930 mV to match system power budgets and design constraints.
• Industrial temperature grade  Rated for operation from –40°C to 100°C for deployment in industrial environments.
• Package and mounting  572-ball FCBGA (25 × 25) in a surface-mount package for compact, high-density PCB designs.
• RoHS compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

• High-speed serial communications  Transceiver-capable architecture and plentiful I/Os make this device well-suited for FPGA-based network and link-layer functions.
• Signal processing and acceleration  High logic density and on-chip RAM support hardware-accelerated processing pipelines and buffering.
• Industrial control and automation  Industrial-grade temperature range and robust packaging enable deployment in factory automation and process-control equipment.
• Test and measurement systems  Flexible I/O and programmable logic allow custom data acquisition, preprocessing and protocol implementation.

Unique Advantages

• High integration density: 89,178 logic elements let you consolidate complex functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 6.84 Mbits of on-chip RAM supports local buffering and stateful algorithms without immediate external memory.
• Versatile interfacing: 260 I/Os provide extensive connectivity options for peripherals, sensors and high-speed links.
• Industrial robustness: –40°C to 100°C operating range and industrial grade classification support demanding environmental deployments.
• Compact system footprint: 572-FBGA surface-mount package offers a high-pin-count solution in a compact 25 × 25 form factor.
• Standards-conscious manufacturing: RoHS compliance aligns with contemporary environmental and supply-chain requirements.

Why Choose EP2AGX95DF25I3?

The EP2AGX95DF25I3 combines a high number of logic elements, multi-megabit on-chip RAM and a large I/O complement in an industrial-grade Arria II GX FPGA. It is a strong candidate for designs that require programmable logic density, embedded memory capacity and transceiver-capable I/O within a compact 572-FBGA footprint.

This device is appropriate for engineering teams building industrial automation, communications, signal processing or test equipment where extended temperature operation, RoHS compliance and a low-voltage core are important factors for long-term product deployment.

Request a quote or submit an inquiry to obtain pricing and availability information for EP2AGX95DF25I3.