EP2AGX95EF29I5N

The EP2AGX95EF29I5N is an Arria II GX FPGA IC from Intel, offered in an industrial-grade speed/temperature configuration. It provides a high-density programmable logic fabric with substantial embedded memory and I/O capability in a compact FCBGA package for surface-mount applications.

Key electrical and switching characteristics, including transceiver performance and absolute maximum ratings, are documented in the Arria II device handbook and device datasheet for Arria II GX devices. The device is RoHS compliant and designed to operate from a core supply range of 870 mV to 930 mV and an ambient temperature range of −40 °C to 100 °C.

Key Features

• High Logic Capacity — 89,178 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 6.84 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• Extensive I/O — 372 I/O pins to support dense peripheral and interface requirements.
• Transceiver and I/O Timing Documentation — Device handbook includes transceiver performance specifications and programmable I/O timing details for design validation.
• Package & Mounting — 780‑BBGA FCBGA package (supplier package: 780‑FBGA, 29 × 29) in a surface-mount form factor for board-level integration.
• Power — Core supply operating range of 870 mV to 930 mV for core power planning and thermal considerations.
• Industrial Grade Temperature — Rated for operation from −40 °C to 100 °C for temperature-critical deployments.
• Environmental Compliance — RoHS compliant for global regulatory alignment.

Typical Applications

• High-speed serial interfaces — Use cases that require transceiver performance and programmable I/O timing, as detailed in the Arria II GX device documentation.
• High-density logic and embedded processing — Designs that benefit from a large number of logic elements and on-chip RAM for custom hardware acceleration and complex state machines.
• Industrial systems — Applications that require operation across an extended temperature range (−40 °C to 100 °C) and robust surface-mount packaging.

Unique Advantages

• Substantial programmable resources: 89,178 logic elements enable implementation of complex custom logic without external ASICs.
• On-chip memory for performance: Approximately 6.84 Mbits of embedded RAM reduces dependence on external memory for latency-sensitive functions.
• High I/O density: 372 I/O pins accommodate multiple interfaces and parallel buses, simplifying system-level routing.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• Compact BGA packaging: 780‑BBGA FCBGA (780‑FBGA, 29 × 29) balances density and board real estate for surface-mount assembly.
• Standards-based documentation: Device handbook and datasheet provide electrical characteristics, absolute maximum ratings, and transceiver specifications for rigorous validation.

Why Choose EP2AGX95EF29I5N?

The EP2AGX95EF29I5N positions itself as a high-density Arria II GX FPGA option for designs that need a large logic fabric, significant on-chip memory, and a high count of I/O in an industrial-temperature, surface-mount package. Its documented electrical and transceiver characteristics enable confident system-level power and timing planning.

This device is appropriate for engineering teams building complex programmable logic solutions where integration density, embedded memory, and wide operating temperature are key selection criteria. Manufacturer documentation for the Arria II family supplies the detailed specifications necessary for design validation and qualification.

Request a quote or submit an RFQ to receive pricing and availability for EP2AGX95EF29I5N and to discuss how this Arria II GX FPGA can meet your project requirements.