EP2AGX45DF29C6

The EP2AGX45DF29C6 is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 780‑FBGA (29×29) surface‑mount package. This commercial‑grade FPGA integrates reprogrammable logic, substantial embedded memory, and a high I/O count to support complex, high‑density digital designs.

Device documentation for the Arria II family describes the electrical and switching characteristics, including operating conditions, core and periphery performance, transceiver and I/O timing behavior.

Key Features

• Logic Capacity — 42,959 logic elements to implement sizable digital designs and complex logic functions.
• Embedded Memory — Approximately 3.52 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 364 user I/O pins to support multiple parallel interfaces and high‑pin‑count connectivity.
• Power — Voltage supply range specified as 870 mV to 930 mV to match the device core operating window.
• Package & Mounting — 780‑FBGA (29×29) FCBGA package, surface‑mount for compact board integration and thermal conduction through the BGA land pattern.
• Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant — Meets RoHS environmental requirements for lead‑free assembly.
• Manufacturer & Documentation — Part of the Arria II GX family from Intel; detailed device handbook and datasheet provide full electrical and switching specifications.

Typical Applications

• High‑density interface bridging — The 364 I/Os and abundant logic elements support implementing protocol bridges and parallel interface aggregators.
• Custom digital processing — Large logic capacity and on‑chip RAM enable application‑specific datapath acceleration and control logic.
• Prototyping and system integration — Reprogrammable FPGA fabric allows iterative development and integration of peripheral logic within compact board layouts.

Unique Advantages

• Substantial logic resources: 42,959 logic elements provide room for complex finite state machines, custom datapaths, and control logic without immediately requiring higher‑density parts.
• On‑chip memory for buffering: Approximately 3.52 Mbits of embedded RAM reduces reliance on external memory for many local data storage needs.
• High I/O count: 364 I/Os support multiple interfaces or wide parallel buses, simplifying board-level routing and connector requirements.
• Compact BGA footprint: 780‑FBGA (29×29) package provides a dense, surface‑mount solution suitable for space-constrained PCBs.
• Commercial operating window: Rated 0 °C to 85 °C for standard commercial deployments and environments.
• Regulatory readiness: RoHS compliance supports lead‑free assembly in modern manufacturing processes.

Why Choose EP2AGX45DF29C6?

The EP2AGX45DF29C6 positions itself as a practical choice for designs that require a balance of logic capacity, on‑chip memory, and high I/O density in a compact BGA package. Its commercial grade and RoHS compliance make it suitable for mainstream embedded and digital system applications where reprogrammable logic and board‑level integration are priorities.

Designers seeking detailed electrical and switching characteristics can refer to the Arria II device documentation for complete specifications to ensure correct power sequencing, I/O timing, and system integration.

If you would like pricing, availability, or a formal quote for EP2AGX45DF29C6, submit a request and our team will respond with the latest commercial details and lead‑time information.