EP2AGX45DF29C5

The EP2AGX45DF29C5 is an Arria II GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 780‑ball FCBGA package. It delivers a combination of programmable logic, on‑chip memory, and a large I/O count suitable for compact, board‑level FPGA implementations.

As part of the Arria II family, the device targets applications that require integrated transceiver and PCI Express (PIPE) support alongside substantial programmable logic. Core specifications include 42,959 logic elements, approximately 3.5 Mbits of embedded memory, and up to 364 I/O pins, with a commercial operating range and low‑voltage core supply.

Key Features

• Programmable Logic  Approximately 42,959 logic elements provide dense, user‑programmable logic resources for custom digital functions.
• Embedded Memory  Total on‑chip RAM of 3,517,440 bits (approximately 3.5 Mbits) to support buffering, state machines, and memory‑based logic structures.
• I/O Capacity  Up to 364 I/O pins enable rich external interfacing and board‑level connectivity.
• Integrated Transceiver and PCIe Support  Arria II GX device family includes transceiver performance specifications and PCI Express (PIPE) HIP block support as documented in the device handbook.
• Power (Core)  Core voltage supply range specified at 870 mV to 930 mV for the device core domain.
• Package and Mounting  780‑ball BGA (FCBGA), supplier package 780‑FBGA (29×29), surface‑mount package suitable for compact board designs.
• Commercial Grade Temperature  Rated for operation from 0 °C to 85 °C (commercial grade).
• Environmental Compliance  RoHS compliant.

Typical Applications

• PCI Express endpoint and bridging  Use the Arria II GX PCI Express (PIPE) HIP block support for implementing PCIe interfaces and board‑level host/adapter logic.
• Serial link and protocol bridging  Leverage the device family’s transceiver capabilities for serial protocol bridging and link implementations.
• Custom logic and control  Deploy the 42,959 logic elements and on‑chip memory for complex state machines, protocol handling, and control logic in embedded systems.
• High‑density I/O designs  The 364 available I/Os support multi‑channel sensor interfaces, peripheral expansion, and mixed‑signal board integration.

Unique Advantages

• High logic density: 42,959 logic elements enable substantial custom logic integration without external ASICs or discrete glue logic.
• Significant on‑chip memory: Approximately 3.5 Mbits of embedded RAM reduce dependency on external memory for buffering and lookup tables.
• Broad I/O resources: 364 I/Os provide flexibility for diverse peripheral and system interfacing needs.
• Integrated serial and PCIe support: Family‑level transceiver and PCIe (PIPE) HIP block capabilities simplify implementation of high‑speed interfaces.
• Compact board footprint: 780‑ball FCBGA (29×29) surface‑mount package balances I/O density with a compact package suitable for constrained PCB area.
• Commercial‑grade operation: Specified 0 °C to 85 °C operating range aligns with standard commercial embedded applications.

Why Choose EP2AGX45DF29C5?

EP2AGX45DF29C5 combines a substantial logic fabric, multiple megabits of embedded RAM, and a high I/O count in a compact 780‑ball FCBGA package from Intel’s Arria II GX family. The device is well suited for designs that require integrated transceiver and PCI Express support alongside dense programmable logic within commercial temperature and low‑voltage core requirements.

For engineers and procurement teams building board‑level FPGA solutions, this part offers a clear balance of integration, I/O flexibility, and on‑chip memory to simplify designs and reduce external component count while remaining RoHS compliant.

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