EP2AGX45DF25I5N

The EP2AGX45DF25I5N is an Intel Arria II GX field programmable gate array (FPGA) offered in an industrial-grade, surface-mount 572-FBGA package. It provides a combination of substantial programmable logic, embedded memory, and a high I/O count for designs that require on-chip resources and robust operating conditions.

Designed for systems that need programmable logic, embedded RAM, and extensive I/O, this device is targeted at industrial applications and board-level integration where operating temperature range and compact ball-grid packaging are important.

Key Features

• Programmable Logic — 42,959 logic elements (cells) to implement custom digital functions and control logic.
• Embedded Memory — Approximately 3.52 Mbits of on-chip RAM for buffering, state storage, or small lookup tables.
• I/O Capability — 252 user I/Os to support multiple parallel interfaces and board-level signal routing.
• Package & Mounting — 572-FBGA (FC) surface-mount package, supplier designation 572-FBGA, FC (25×25), suitable for compact board layouts.
• Power Supply — Core voltage supply range of 870 mV to 930 mV to match system power-rail requirements.
• Industrial Temperature Range — Rated for operation from –40°C to 100°C, supporting deployments in extended-temperature environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Industrial temperature rating and robust packaging make this FPGA suitable for control logic, sequencing, and deterministic processing in factory or field equipment.
• Protocol Bridging and I/O Aggregation — High I/O count supports bridging between multiple interfaces and handling parallel signal buses on a single device.
• On-board Data Buffering and Processing — Embedded RAM provides local buffering and temporary storage for data paths, packet handling, or small-scale DSP tasks.
• Board-level FPGA Integration — Surface-mount 572-FBGA package enables compact, high-density board designs where board space and thermal considerations are important.

Unique Advantages

• High Logic Capacity: 42,959 logic elements provide substantial on-chip resources for complex finite-state machines, control logic, and custom datapaths.
• On-chip Memory: Approximately 3.52 Mbits of embedded RAM reduces dependency on external memory for mid-sized buffering and lookup needs.
• Extensive I/O: 252 I/Os allow direct interfacing to multiple peripherals and high-pin-count parallel buses without extensive external glue logic.
• Industrial-rated Operation: −40°C to 100°C operating range supports deployment in harsh or temperature-variable environments.
• Compact Ball-Grid Package: 572-FBGA (25×25) offers a compact footprint for high-density PCBs while maintaining signal I/O density.
• RoHS Compliance: Meets regulatory requirements for lead-free manufacturing and environmentally conscious designs.

Why Choose EP2AGX45DF25I5N?

The EP2AGX45DF25I5N combines a substantial logic element count, meaningful on-chip RAM, and a high number of user I/Os in a compact, surface-mount 572-FBGA package. Its industrial-grade temperature rating and controlled core voltage range make it a practical choice for embedded systems and industrial applications that require reliable programmable logic and local memory resources.

This device is part of the Arria II GX family covered in the device handbook, which provides detailed electrical and switching characteristics to support system-level design and validation. Choose this FPGA when you need a balanced combination of logic resources, I/O capacity, embedded memory, and industrial operating range for board-level FPGA integration.

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