EP2AGX45DF25I5G

The EP2AGX45DF25I5G is an Arria II GX field-programmable gate array (FPGA) from Intel, delivered in a 572-ball FCBGA package (25×25 mm) for surface-mount assembly. It provides a balance of logic capacity, embedded memory and I/O capability for industrial-grade designs that require a programmable hardware fabric.

Key on-chip resources include 42,959 logic elements, approximately 3.5 Mbits of embedded memory, and 252 general-purpose I/Os, while the device operates over a core voltage range of 870 mV to 930 mV and an industrial temperature range of −40 °C to 100 °C.

Key Features

• Logic Capacity  42,959 logic elements for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM for buffering, state storage and intermediate data processing.
• I/O Resources  252 I/O pins to interface with a wide range of peripherals, buses and external devices.
• Package & Mounting  572-BGA (FCBGA) package, 25×25 mm supplier device package, designed for surface-mount PCB assembly.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power delivery requirements.
• Operating Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• Substantial programmable logic: 42,959 logic elements give designers room to implement complex state machines, datapaths and custom accelerators without offloading to external devices.
• On-chip memory capacity: Approximately 3.5 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs, simplifying BOM and board routing.
• Wide I/O count: 252 I/Os enable flexible interfacing options across multiple peripherals and parallel interfaces, supporting diverse system topologies.
• Industrial temperature tolerance: Rated for −40 °C to 100 °C, suitable for industrial applications where extended temperature operation is required.
• Compact BGA package: 572-ball FCBGA (25×25 mm) offers a compact footprint for dense board designs while maintaining robust connectivity.
• Controlled core supply range: 870 mV–930 mV core supply helps ensure compatibility with regulated power domains and predictable power planning.

Why Choose EP2AGX45DF25I5G?

The EP2AGX45DF25I5G positions itself as a flexible, industrial-grade FPGA option that combines substantial logic capacity, on-chip memory and a high I/O count in a compact 572-BGA package. These attributes make it suitable for designers who need a programmable hardware platform with predictable power and thermal characteristics.

Backed by Intel as the manufacturer, this device is suited to development teams and procurement organizations seeking a robust FPGA fabric that integrates logic, memory and I/O on a single device, helping to reduce system complexity and support long-term deployment needs.

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