EP2AGX45DF25I5

The EP2AGX45DF25I5 is an Arria II GX Field Programmable Gate Array (FPGA) in a 572-ball FCBGA package designed for industrial applications. It combines a high logic capacity with embedded memory and a broad I/O count to support complex, configurable digital functions.

With 42,959 logic elements, approximately 3.5 Mbits of on-chip RAM and 252 I/O pins, this device is targeted at system designs that require substantial programmable logic, flexible interfacing, and operation across an extended industrial temperature range.

Key Features

• Logic Capacity  42,959 logic elements and 1,805 logic array blocks (LABs) to implement complex custom logic and state machines.
• Embedded Memory  Total on-chip RAM of 3,517,440 bits (approximately 3.5 Mbits) for FIFOs, buffers, and local storage.
• I/O Resources  252 I/O pins to support multiple interfaces and peripheral connections directly at the package level.
• Power and Core Supply  Core supply operating range of 870 mV to 930 mV, enabling operation within specified core-voltage limits.
• Package and Mounting  572-BGA (FCBGA) 25×25 supplier device package in a surface-mount form factor, suitable for dense board designs.
• Industrial Grade  Specified as an industrial-grade device with an operating temperature range of –40 °C to 100 °C for deployment in harsh environments.
• Environmental Compliance  RoHS-compliant manufacturing status for regulatory and supply-chain considerations.

Typical Applications

• Industrial Control and Automation  Leverages the industrial temperature range and plentiful I/O to interface sensors, actuators, and control buses in factory and process-automation equipment.
• Embedded Systems and Prototyping  Provides large programmable logic capacity and on-chip RAM for custom digital processing, protocol handling, and system integration tasks.
• Communications and I/O Aggregation  252 I/O pins enable aggregation and protocol translation between multiple peripheral and interface standards on a single device.

Unique Advantages

• Substantial Logic Density:  42,959 logic elements allow implementation of sophisticated datapaths and control logic without immediate need for multiple devices.
• On-Chip Memory:  Approximately 3.5 Mbits of embedded RAM reduces external memory dependencies for buffering and local storage.
• High I/O Count:  252 I/Os simplify board-level design by enabling direct connections to numerous peripherals and interfaces.
• Industrial Reliability:  Rated for –40 °C to 100 °C operation to meet requirements for deployed industrial systems.
• Standard Surface-Mount Package:  572-ball FCBGA (25×25) supports dense PCB layouts and automated assembly processes.
• Regulatory Compatibility:  RoHS compliance supports environmentally conscious manufacturing and supply chains.

Why Choose EP2AGX45DF25I5?

The EP2AGX45DF25I5 Arria II GX FPGA is positioned for engineers who need a robust, industrial-grade programmable logic device with significant on-chip resources and a high I/O count. Its combination of 42,959 logic elements, approximately 3.5 Mbits of embedded RAM, and 252 I/Os enables integration of complex logic, buffering, and multi-interface connectivity in a single surface-mount package.

This device is suitable for projects that require long-term availability, industrial temperature operation, and RoHS-compliant components, providing a scalable platform for embedded processing, control, and I/O consolidation in demanding environments.

Request a quote or submit a procurement inquiry to get pricing and availability for EP2AGX45DF25I5. Our team will respond with a tailored quotation and lead-time information.