EP2AGX45DF25C6NGA

The EP2AGX45DF25C6NGA is an Intel Arria II GX field programmable gate array (FPGA) supplied in a 572‑ball FCBGA package. It provides a balance of programmable logic capacity, on‑chip memory, and I/O density for commercial electronic designs.

With 42,959 logic elements and approximately 3.5 Mbits of embedded memory, this device is suited to designs that require substantial programmable logic and a moderate amount of on‑chip RAM while operating within commercial temperature and low‑voltage ranges.

Key Features

• Programmable Logic  42,959 logic elements to implement custom digital functions and state machines.
• Embedded Memory  Approximately 3.5 Mbits of on‑chip RAM for buffering, LUTs, and small data storage needs.
• I/O Capacity  252 available I/O pins to interface with multiple peripherals, sensors, or daughtercards.
• Power and Voltage  Operates from a core supply range of 870 mV to 930 mV, enabling low‑voltage core operation.
• Package and Mounting  572‑FBGA, FCBGA (25×25 mm) surface‑mount package for high‑density board integration.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for restricted‑substance conformance in commercial electronics manufacturing.

Typical Applications

• Programmable logic implementations  Implement custom digital logic, state machines, and glue logic where moderate logic capacity and embedded RAM are required.
• I/O‑dense interfacing  Aggregate multiple peripherals or sensor arrays using the device’s 252 I/O pins for system integration and board consolidation.
• OEM and commercial systems  Integrate into commercial electronic products operating within 0 °C to 85 °C that require surface‑mount, high‑density packaging.

Unique Advantages

• Substantial logic capacity: 42,959 logic elements enable complex custom logic and moderate parallel processing without external ASICs.
• Embedded on‑chip memory: Approximately 3.5 Mbits of RAM reduces the need for external memory for many buffering and LUT applications.
• High I/O count: 252 I/Os support extensive peripheral connections and flexible board‑level integration.
• Compact, surface‑mount package: 572‑FBGA (25×25) provides a dense footprint for space‑constrained PCBs while supporting high pin count.
• Low‑voltage core operation: Core voltage range of 870 mV to 930 mV supports low‑power core designs and power budgeting.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial product environments.

Why Choose EP2AGX45DF25C6NGA?

The EP2AGX45DF25C6NGA offers a practical mix of logic density, embedded memory, and I/O resources in a compact FCBGA package for commercial electronic designs. Its specification set supports a wide range of programmable logic tasks while enabling board‑level consolidation and straightforward surface‑mount integration.

This device is well suited for engineers and OEMs designing commercial products that require a balance of programmable logic capacity, on‑chip RAM, and a high I/O count within a defined commercial temperature and low‑voltage operating window. RoHS compliance further supports modern manufacturing requirements.

Request a quote or submit an RFQ today to receive pricing and availability for the EP2AGX45DF25C6NGA.