EP2AGX45DF29C5G
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 364 3517440 42959 780-BBGA, FCBGA |
|---|---|
| Quantity | 1,498 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 364 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1805 | Number of Logic Elements/Cells | 42959 | ||
| Number of Gates | N/A | ECCN | PENDING ECCN | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 3517440 |
Overview of EP2AGX45DF29C5G – Arria II GX FPGA, 780-BBGA (29×29 FCBGA)
The EP2AGX45DF29C5G is an Arria II GX field-programmable gate array (FPGA) in a 780-BBGA FCBGA surface-mount package. It delivers a balanced combination of programmable logic, embedded memory, and I/O density for commercial electronic designs.
Key device attributes include 42,959 logic elements, approximately 3.5 Mbits of embedded RAM, 364 user I/Os, a 780-FBGA (29×29) package, commercial operating range (0 °C to 85 °C), and a supply voltage range of 870 mV to 930 mV. The device is RoHS compliant.
Key Features
- Core Logic Capacity — 42,959 logic elements provide programmable digital resources for implementing custom logic and control functions.
- Embedded Memory — Approximately 3.5 Mbits of on-chip RAM for buffering, state storage, and local data processing.
- I/O Resources — 364 user I/O pins to support diverse peripherals and board-level connectivity.
- Package and Mounting — 780-BBGA (supplier device package: 780-FBGA, 29×29) in a surface-mount FCBGA format for compact board integration.
- Power — Operates from a core supply range of 870 mV to 930 mV, enabling use in designs with defined low-voltage power domains.
- Operating Range & Grade — Commercial grade device specified for 0 °C to 85 °C ambient operation.
- Environmental Compliance — RoHS compliant.
Unique Advantages
- High logic density: 42,959 logic elements offer substantial programmable capacity for complex designs without moving to larger packages.
- Significant on-chip RAM: Approximately 3.5 Mbits of embedded memory reduces dependence on external memory for many control and buffering tasks.
- Generous I/O count: 364 user I/Os provide flexible connectivity for multi-interface designs and dense board-level routing.
- Compact FCBGA package: The 780-FBGA (29×29) package supports a space-efficient board layout while preserving high pin count.
- Low-voltage core operation: Narrow supply range (870 mV–930 mV) for consistent core power budgeting in system designs.
- Commercial temperature and RoHS compliance: Suitable for a wide range of commercial applications with environmental compliance for easier procurement and assembly.
Why Choose EP2AGX45DF29C5G?
The EP2AGX45DF29C5G targets designers who need a mid-to-high density Arria II GX FPGA in a compact surface-mount FCBGA package. Its combination of roughly 43k logic elements, around 3.5 Mbits of embedded RAM, and 364 I/Os makes it suitable for commercial electronic systems that require substantial on-chip resources and flexible connectivity.
Choosing this device provides a balance of programmable logic, embedded memory, and I/O capacity while adhering to commercial temperature and RoHS requirements—helping streamline board integration and procurement for production designs.
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