EP2AGX45DF29C5G

IC FPGA 364 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 364 3517440 42959 780-BBGA, FCBGA

Quantity 1,498 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O364Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1805Number of Logic Elements/Cells42959
Number of GatesN/AECCNPENDING ECCNHTS Code0000.00.0000
QualificationN/ATotal RAM Bits3517440

Overview of EP2AGX45DF29C5G – Arria II GX FPGA, 780-BBGA (29×29 FCBGA)

The EP2AGX45DF29C5G is an Arria II GX field-programmable gate array (FPGA) in a 780-BBGA FCBGA surface-mount package. It delivers a balanced combination of programmable logic, embedded memory, and I/O density for commercial electronic designs.

Key device attributes include 42,959 logic elements, approximately 3.5 Mbits of embedded RAM, 364 user I/Os, a 780-FBGA (29×29) package, commercial operating range (0 °C to 85 °C), and a supply voltage range of 870 mV to 930 mV. The device is RoHS compliant.

Key Features

  • Core Logic Capacity — 42,959 logic elements provide programmable digital resources for implementing custom logic and control functions.
  • Embedded Memory — Approximately 3.5 Mbits of on-chip RAM for buffering, state storage, and local data processing.
  • I/O Resources — 364 user I/O pins to support diverse peripherals and board-level connectivity.
  • Package and Mounting — 780-BBGA (supplier device package: 780-FBGA, 29×29) in a surface-mount FCBGA format for compact board integration.
  • Power — Operates from a core supply range of 870 mV to 930 mV, enabling use in designs with defined low-voltage power domains.
  • Operating Range & Grade — Commercial grade device specified for 0 °C to 85 °C ambient operation.
  • Environmental Compliance — RoHS compliant.

Unique Advantages

  • High logic density: 42,959 logic elements offer substantial programmable capacity for complex designs without moving to larger packages.
  • Significant on-chip RAM: Approximately 3.5 Mbits of embedded memory reduces dependence on external memory for many control and buffering tasks.
  • Generous I/O count: 364 user I/Os provide flexible connectivity for multi-interface designs and dense board-level routing.
  • Compact FCBGA package: The 780-FBGA (29×29) package supports a space-efficient board layout while preserving high pin count.
  • Low-voltage core operation: Narrow supply range (870 mV–930 mV) for consistent core power budgeting in system designs.
  • Commercial temperature and RoHS compliance: Suitable for a wide range of commercial applications with environmental compliance for easier procurement and assembly.

Why Choose EP2AGX45DF29C5G?

The EP2AGX45DF29C5G targets designers who need a mid-to-high density Arria II GX FPGA in a compact surface-mount FCBGA package. Its combination of roughly 43k logic elements, around 3.5 Mbits of embedded RAM, and 364 I/Os makes it suitable for commercial electronic systems that require substantial on-chip resources and flexible connectivity.

Choosing this device provides a balance of programmable logic, embedded memory, and I/O capacity while adhering to commercial temperature and RoHS requirements—helping streamline board integration and procurement for production designs.

Request a quote or submit an inquiry to receive pricing and availability information for EP2AGX45DF29C5G.

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