EP2AGX45DF25C4G

The EP2AGX45DF25C4G is an Intel Arria II GX field programmable gate array (FPGA) offering a substantial logic capacity and embedded memory in a compact FCBGA package. It combines 42,959 logic elements, approximately 3.5 Mbits of on-chip RAM, and a 252-pin I/O count to address logic-dense, memory-aware designs.

Designed for commercial-grade applications, this surface-mount FPGA operates across a core voltage range of 870 mV to 930 mV and an ambient temperature range of 0 °C to 85 °C, with RoHS compliance for regulatory alignment.

Key Features

• Core Logic  42,959 logic elements provide large-scale programmable logic resources for implementing complex custom logic and state machines.
• Embedded Memory  Approximately 3.5 Mbits of on-chip RAM to support data buffering, lookup tables, and distributed memory requirements.
• I/O Density  252 user I/O pins enable connectivity for multi-channel interfaces, parallel buses, and external peripherals.
• Power and Voltage  Core supply range of 870 mV to 930 mV to match system-level power architectures and core voltage domains.
• Package and Mounting  572-ball FCBGA package in a 25×25 format (572-FBGA, FC) optimized for surface-mount PCB assembly and compact board layouts.
• Operating Range and Grade  Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant for environmental conformity.

Typical Applications

• Logic-Intensive Systems  Implements custom datapaths, protocol engines, and control logic where high logic capacity and embedded RAM are required.
• Communications Equipment  Provides I/O density and on-chip memory useful for protocol bridging, packet processing, and interface aggregation functions.
• Prototyping and Hardware Acceleration  Suitable for FPGA-based prototyping and acceleration tasks that need a balance of logic resources and embedded RAM.

Unique Advantages

• High Logic Capacity: 42,959 logic elements let you implement large, complex designs without immediate partitioning across multiple devices.
• Substantial On-Chip Memory: Approximately 3.5 Mbits of embedded RAM reduces dependency on external memory for buffering and lookup tasks.
• Generous I/O Count: 252 I/O pins support multi-channel connectivity and flexible interface routing on compact PCBs.
• Compact BGA Packaging: 572-FBGA (25×25) offers a dense footprint for space-constrained designs while supporting surface-mount assembly.
• Commercial Operating Range: Rated for 0 °C to 85 °C operation to match typical commercial deployment environments.
• Regulatory Compliance: RoHS compliance aligns the device with common environmental requirements.

Why Choose EP2AGX45DF25C4G?

The EP2AGX45DF25C4G positions itself as a high-capacity Arria II GX FPGA option for designs that require a large number of logic elements and on-chip memory in a compact FCBGA footprint. Its combination of 42,959 logic elements, approximately 3.5 Mbits of embedded RAM, and 252 I/O pins makes it suitable for developers building complex logic functions and memory-intensive modules within commercial temperature ranges.

Choosing this Intel-manufactured FPGA provides a clear hardware platform for scalable designs where integration, I/O flexibility, and a compact package matter. It is well suited to engineering teams seeking a commercially graded, RoHS-compliant programmable device with documented package and electrical parameters.

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