EP2AGX45CU17I5

The EP2AGX45CU17I5 is an Arria II GX Field Programmable Gate Array (FPGA) in a 358-ball LFBGA/UBGA (17×17) package optimized for surface-mount assembly. The device provides 42,959 logic elements and approximately 3.52 Mbits of embedded RAM to implement custom digital logic, buffering and on-chip data storage, and general-purpose I/O connectivity.

Designed and supplied as an industrial-grade device, this FPGA supports an operating temperature range of −40 °C to 100 °C and a core supply range of 870 mV to 930 mV. The device is RoHS-compliant and is documented in the Arria II device handbook, which details electrical and switching characteristics including I/O timing and transceiver-related information for the Arria II GX family.

Key Features

• Core Logic  42,959 logic elements for implementing complex programmable logic and glue logic within your system.
• Embedded Memory  Approximately 3.52 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Resources  156 user I/O pins to interface with peripherals, sensors, and system buses.
• Package & Mounting  358-ball LFBGA / UBGA (17×17) package in a surface-mount form factor for high-density board layouts.
• Power  Core supply specified between 870 mV and 930 mV to align with system power-rail design and power budgeting.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in thermally demanding environments.
• Standards & Compliance  RoHS-compliant manufacturing to satisfy regulatory and environmental requirements.
• Documentation  Supported by the Arria II device handbook and device datasheet covering electrical characteristics, switching behavior, and I/O timing.

Unique Advantages

• Substantial logic capacity: 42,959 logic elements enable medium‑to‑large programmable designs without immediate need for multiple devices.
• On-chip memory for system simplification: Approximately 3.52 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Ample I/O connectivity: 156 I/Os provide flexibility to connect sensors, interfaces, and external peripherals directly to the FPGA fabric.
• Industrial-grade thermal range: −40 °C to 100 °C rating supports deployment in environments with wide temperature swings.
• Compact BGA packaging: 358-ball LFBGA/UBGA 17×17 package enables high-density board integration while supporting surface-mount assembly.
• Regulatory compliance: RoHS status simplifies compliance planning for commercial and industrial electronics projects.

Why Choose EP2AGX45CU17I5?

The EP2AGX45CU17I5 combines a substantial logic element count and multi-megabit on-chip RAM in a compact 358-ball BGA package rated for industrial temperatures. This balance of logic capacity, embedded memory, and I/O density makes it suitable for designs that require integrated programmable logic and local data storage in thermally and mechanically constrained assemblies.

Detailed device-level documentation in the Arria II handbook and datasheet provides the electrical, switching, and I/O timing information needed for confident integration and system-level planning.

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