EP2AGX45CU17C4N
| Part Description |
Arria II GX Field Programmable Gate Array (FPGA) IC 156 3517440 42959 358-LFBGA, FCBGA |
|---|---|
| Quantity | 781 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 358-UBGA, FCBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 358-LFBGA, FCBGA | Number of I/O | 156 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1805 | Number of Logic Elements/Cells | 42959 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3517440 |
Overview of EP2AGX45CU17C4N – Arria II GX Field Programmable Gate Array (FPGA) IC, 156 I/O, approximately 3.5 Mbits RAM, 42,959 logic elements, 358-LFBGA
The EP2AGX45CU17C4N is an Intel Arria II GX field programmable gate array (FPGA) offered in a 358‑LFBGA FCBGA package. It delivers a substantial logic fabric and embedded RAM capacity for implementing custom digital logic, on‑chip buffering, and high‑speed serial connectivity elements described in the device handbook.
Designed for commercial applications, this device combines high logic density, embedded memory, and 156 general I/O pins in a surface‑mount BGA package, supporting core supply operation within 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core logic 42,959 logic elements for implementing complex combinational and sequential logic functions across the device.
- Embedded memory Approximately 3.5 Mbits of on‑chip RAM bits for data buffering, FIFOs, and small working memories.
- I/O and serial connectivity 156 general I/O pins; device handbook and datasheet content describe transceiver performance and PCI Express (PIPE) HIP block support for high‑speed serial interfaces.
- Voltage and power Core voltage supply range specified at 870 mV to 930 mV; datasheet provides detailed electrical characteristics and absolute maximum ratings for design reference.
- Package and mounting 358‑LFBGA (FCBGA) / supplier device package 358‑UBGA (17×17) in a surface‑mount BGA format for compact board integration.
- Operating range & compliance Commercial grade device with an operating temperature range of 0 °C to 85 °C; RoHS compliant.
Typical Applications
- High‑speed serial connectivity Designs utilizing transceivers and PCI Express (PIPE) HIP block capabilities described in the datasheet for serial link implementations.
- Custom logic and hardware acceleration Implement application‑specific logic using 42,959 logic elements and on‑chip RAM for algorithmic functions and data staging.
- I/O interface consolidation Platforms requiring numerous general I/Os (156 pins) to aggregate multiple peripheral interfaces onto a single FPGA device.
Unique Advantages
- Substantial logic capacity: The device’s 42,959 logic elements enable implementation of large, integrated logic designs without immediate need for external logic ICs.
- Significant embedded memory: Approximately 3.5 Mbits of on‑chip RAM supports buffering and local storage to reduce external memory bandwidth requirements.
- High I/O count in a compact package: 156 I/O pins in a 358‑LFBGA package facilitate dense interfacing while keeping board footprint compact.
- Commercial operating range: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial products and systems.
- Datasheet depth: Extensive Arria II device handbook coverage (electrical characteristics, transceiver specifications, I/O timing) is available for design verification and system integration.
Why Choose EP2AGX45CU17C4N?
The EP2AGX45CU17C4N positions itself as a versatile commercial‑grade FPGA offering a balance of high logic density, embedded memory, and robust I/O in a surface‑mount BGA package. It is suitable for designs that require consolidated custom logic, on‑chip buffering, and support for high‑speed serial elements documented in the Arria II device handbook.
Engineers and procurement teams seeking a compact FPGA with verified electrical characteristics, documented transceiver performance, and a defined operating envelope (870 mV–930 mV core, 0 °C–85 °C) can evaluate this device for mid‑ to high‑complexity digital designs.
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