EP2AGX45CU17C4N

IC FPGA 156 I/O 358UBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 156 3517440 42959 358-LFBGA, FCBGA

Quantity 781 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package358-UBGA, FCBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case358-LFBGA, FCBGANumber of I/O156Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1805Number of Logic Elements/Cells42959
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3517440

Overview of EP2AGX45CU17C4N – Arria II GX Field Programmable Gate Array (FPGA) IC, 156 I/O, approximately 3.5 Mbits RAM, 42,959 logic elements, 358-LFBGA

The EP2AGX45CU17C4N is an Intel Arria II GX field programmable gate array (FPGA) offered in a 358‑LFBGA FCBGA package. It delivers a substantial logic fabric and embedded RAM capacity for implementing custom digital logic, on‑chip buffering, and high‑speed serial connectivity elements described in the device handbook.

Designed for commercial applications, this device combines high logic density, embedded memory, and 156 general I/O pins in a surface‑mount BGA package, supporting core supply operation within 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core logic  42,959 logic elements for implementing complex combinational and sequential logic functions across the device.
  • Embedded memory  Approximately 3.5 Mbits of on‑chip RAM bits for data buffering, FIFOs, and small working memories.
  • I/O and serial connectivity  156 general I/O pins; device handbook and datasheet content describe transceiver performance and PCI Express (PIPE) HIP block support for high‑speed serial interfaces.
  • Voltage and power  Core voltage supply range specified at 870 mV to 930 mV; datasheet provides detailed electrical characteristics and absolute maximum ratings for design reference.
  • Package and mounting  358‑LFBGA (FCBGA) / supplier device package 358‑UBGA (17×17) in a surface‑mount BGA format for compact board integration.
  • Operating range & compliance  Commercial grade device with an operating temperature range of 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • High‑speed serial connectivity  Designs utilizing transceivers and PCI Express (PIPE) HIP block capabilities described in the datasheet for serial link implementations.
  • Custom logic and hardware acceleration  Implement application‑specific logic using 42,959 logic elements and on‑chip RAM for algorithmic functions and data staging.
  • I/O interface consolidation  Platforms requiring numerous general I/Os (156 pins) to aggregate multiple peripheral interfaces onto a single FPGA device.

Unique Advantages

  • Substantial logic capacity: The device’s 42,959 logic elements enable implementation of large, integrated logic designs without immediate need for external logic ICs.
  • Significant embedded memory: Approximately 3.5 Mbits of on‑chip RAM supports buffering and local storage to reduce external memory bandwidth requirements.
  • High I/O count in a compact package: 156 I/O pins in a 358‑LFBGA package facilitate dense interfacing while keeping board footprint compact.
  • Commercial operating range: Rated for 0 °C to 85 °C and RoHS compliant for mainstream commercial products and systems.
  • Datasheet depth: Extensive Arria II device handbook coverage (electrical characteristics, transceiver specifications, I/O timing) is available for design verification and system integration.

Why Choose EP2AGX45CU17C4N?

The EP2AGX45CU17C4N positions itself as a versatile commercial‑grade FPGA offering a balance of high logic density, embedded memory, and robust I/O in a surface‑mount BGA package. It is suitable for designs that require consolidated custom logic, on‑chip buffering, and support for high‑speed serial elements documented in the Arria II device handbook.

Engineers and procurement teams seeking a compact FPGA with verified electrical characteristics, documented transceiver performance, and a defined operating envelope (870 mV–930 mV core, 0 °C–85 °C) can evaluate this device for mid‑ to high‑complexity digital designs.

Request a quote or submit an inquiry to get pricing and availability for EP2AGX45CU17C4N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up