EP2AGX190FF35C4

The EP2AGX190FF35C4 is an Arria II GX field‑programmable gate array (FPGA) IC from Intel, supplied in a 1152‑FBGA (35×35) package for surface‑mount applications. This commercial C4 speed‑grade device combines a high logic‑element count with substantial on‑chip memory and a large I/O footprint for complex, high‑density designs.

Designed for applications that require significant programmable logic, embedded memory and extensive I/O, the device delivers a balance of integration and deterministic electrical characteristics within a commercial operating range.

Key Features

• High Logic Density — 181,165 logic elements to support complex custom logic and parallel processing architectures.
• Embedded Memory — Approximately 10.18 Mbits of on‑chip RAM for buffering, FIFOs and on‑chip data storage.
• Extensive I/O — 612 user I/O pins to enable broad peripheral interfacing and board‑level connectivity.
• Package and Mounting — 1152‑BBGA / FCBGA package (supplier package: 1152‑FBGA, 35×35) in a surface‑mount form factor for compact, high‑pin‑count designs.
• Power — Core voltage supply range from 870 mV to 930 mV, enabling defined power domain planning for system integration.
• Commercial Grade Operation — Rated for 0 °C to 85 °C operating temperature, suitable for commercial‑class products and environments.
• Standards and Compliance — RoHS compliant to support regulatory and manufacturing requirements.
• Family Capabilities (from device handbook) — Arria II GX device family documentation includes detailed electrical and transceiver performance specifications, supporting advanced I/O and periphery timing considerations.

Typical Applications

• Networking & Communications — High logic density and extensive I/O support protocol offload, packet processing and interface aggregation in communication equipment.
• Signal Processing — Large embedded RAM and abundant logic elements enable buffering, filtering and real‑time processing in DSP‑oriented designs.
• Custom Hardware Acceleration — Programmable fabric and high I/O count allow implementation of application‑specific accelerators and hardware pipelines.

Unique Advantages

• Substantial Logic Resources: 181,165 logic elements provide the capacity to implement large, complex designs without external programmable logic.
• Significant On‑chip Memory: Approximately 10.18 Mbits of embedded RAM reduces dependence on external memory for intermediate data storage and low‑latency buffers.
• High I/O Count: 612 I/Os simplify board routing and allow direct interfacing to a wide variety of peripherals and subsystems.
• Compact, High‑Pin Package: 1152‑FBGA (35×35) delivers high pin density in a surface‑mount package for space‑constrained designs.
• Commercial Operating Range: 0 °C to 85 °C rating and RoHS compliance support mainstream product deployments and manufacturing requirements.

Why Choose EP2AGX190FF35C4?

The EP2AGX190FF35C4 targets designers who need a high‑density, commercially rated FPGA with abundant logic, on‑chip memory and I/O capacity in a compact ball‑grid package. Its defined core voltage window and documented device family characteristics support predictable integration into systems that require substantial programmable logic and memory resources.

Ideal for engineering teams building networking, signal processing or custom acceleration solutions, this Arria II GX device provides a scalable platform with the resources necessary to consolidate functions, reduce external components and streamline board‑level integration.

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