EP2AGX190EF29I5G

IC FPGA 372 I/O 780FBGA
Part Description

Arria II GX Field Programmable Gate Array (FPGA) IC 372 10177536 181165 780-BBGA, FCBGA

Quantity 1,397 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O372Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7612Number of Logic Elements/Cells181165
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits10177536

Overview of EP2AGX190EF29I5G – Arria II GX FPGA, 181,165 logic elements

The EP2AGX190EF29I5G is an Intel Arria II GX field-programmable gate array (FPGA) supplied in a 780-ball FCBGA package. It provides a high-capacity, low-power 40 nm FPGA fabric suitable for designs that require substantial programmable logic, embedded memory, and a large complement of I/O.

With 181,165 logic elements, approximately 10 Mbits of on-chip RAM, and 372 user I/Os, this industrial-grade, surface-mount device targets communications, networking, and high-bandwidth system applications where integration, performance, and temperature tolerance matter.

Key Features

  • Programmable Logic  181,165 logic elements (adaptive logic modules) for implementing complex custom logic and control functions.
  • Embedded Memory  Approximately 10 Mbits of on-chip RAM to support buffering, lookup tables, and embedded data structures.
  • I/O Capacity  372 user I/O pins to support wide parallel interfaces and mixed-signal I/O standards.
  • Transceiver & Interface Support (family-level)  Arria II family devices provide transceiver capability and protocol support for common high-speed serial standards and interface IP, simplifying implementation of PCIe, Ethernet, DDR3 memory interfaces, and other serial protocols.
  • DSP and Math Blocks (family-level)  High-performance DSP blocks and configurable multipliers for signal processing tasks; family documentation describes multipliers configurable in multiple precisions and hardcoded arithmetic resources.
  • Process & Architecture  40 nm, low-power FPGA engine and eight-input fracturable look-up tables as described in the Arria II device family documentation.
  • Package & Mounting  780-ball FCBGA (29 × 29) package; surface-mount mounting type for standard PCB assembly.
  • Power Supply Range  Specified core supply range from 870 mV to 930 mV to match system power rails and management strategies.
  • Operating Temperature  Industrial temperature rating from −40 °C to 100 °C for designs that require extended-range thermal tolerance.
  • Regulatory Status  RoHS compliant.

Typical Applications

  • Network & Communications Equipment  Implements protocol handling, packet processing, and physical-layer interfaces for routers, switches, and telecom radios using the Arria II family’s serial and PHY capabilities.
  • High-Bandwidth System Interfaces  Acts as a bridge and controller for high-speed links and memory interfaces such as PCIe and DDR3 as documented for the Arria II family.
  • Video and Broadcast Systems  Processes SD/HD/3G video streams and Serial Digital Interface (SDI) protocols using embedded DSP resources and serial-interface functionality.
  • Industrial Control & Test Equipment  Provides programmable logic, abundant I/O, and extended temperature range for instrumentation, automation controllers, and test platforms.

Unique Advantages

  • High Logic Density:  181,165 logic elements enable large-scale custom logic implementations without immediate need for multiple FPGAs.
  • Substantial On-Chip Memory:  Approximately 10 Mbits of embedded RAM reduces external memory dependency for buffering and local data storage.
  • Large I/O Count:  372 I/Os provide flexibility for wide parallel buses, multiple interfaces, and mixed-signal integration on a single device.
  • Industrial Temperature Range:  Rated from −40 °C to 100 °C to support deployment in temperature-challenging environments.
  • Designed for System Interfaces:  Arria II family documentation highlights ready support for common high-speed serial protocols and PHY-level functions, easing integration of Ethernet, PCIe, and memory interfaces.
  • Compact, Serviceable Package:  780-ball FCBGA (29 × 29) package fits high-density PCB layouts while supporting surface-mount assembly processes.

Why Choose EP2AGX190EF29I5G?

The EP2AGX190EF29I5G combines a high logic element count, significant embedded memory, and a large I/O complement in an industrial-grade Arria II GX FPGA. It is well suited to designers needing a programmable platform for high-bandwidth interfaces, signal processing, and multi-protocol communication tasks while meeting extended temperature requirements.

Backed by Arria II family design resources and tool support described in the device documentation, this device offers a balanced combination of integration, performance, and system-level interface support for demanding embedded and networking applications.

Request a quote or submit an inquiry to purchase EP2AGX190EF29I5G and discuss availability and pricing for your project requirements.

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