EP2AGX190EF29I3G

The EP2AGX190EF29I3G is a Field Programmable Gate Array (FPGA) from the Intel Arria II device family, built on a 40‑nm low‑power FPGA engine. It combines high logic density with integrated memory and high‑speed serial capabilities to address demanding communications, networking, and DSP‑centric designs.

With 181,165 logic elements, approximately 10.18 Mbits of embedded memory, and 372 user I/Os in a compact 780‑FBGA (29×29) surface‑mount package, this industrial‑grade device is targeted at applications that require high throughput, configurable logic, and robust temperature tolerance from −40 °C to 100 °C.

Key Features

• Core & Architecture  40‑nm, low‑power Arria II FPGA architecture optimized for integration of high‑bandwidth interfaces and programmable logic.
• Logic Resources  181,165 logic elements provide a large, flexible fabric for implementing complex custom logic and control functions.
• Embedded Memory  Approximately 10.18 Mbits of on‑chip RAM for FIFOs, buffers, and intermediate data storage.
• High‑Performance DSP  On‑device DSP capabilities (documented family features include high‑performance DSP blocks and a range of multiplier configurations) for signal processing tasks.
• High‑Speed Transceivers  Arria II family transceiver capability includes up to 24 full‑duplex CDR‑based transceivers supporting data rates from 600 Mbps to 6.375 Gbps, suitable for serial protocols and high‑bandwidth links.
• Flexible I/O & Termination  372 user I/O pins with on‑chip series/parallel and differential termination options (auto‑calibration for single‑ended I/Os and on‑chip differential termination for differential I/O).
• Security & Configuration  Supports 256‑bit AES programming file encryption with volatile and non‑volatile key storage options for design protection.
• Package & Mounting  Surface‑mount 780‑FBGA (29×29) FCBGA package (package case listed as 780‑BBGA, FCBGA) for dense PCB implementations.
• Operating Range & Supply  Industrial temperature range of −40 °C to 100 °C and a core voltage supply range of 870 mV to 930 mV.

Typical Applications

• High‑Speed Networking  Implements Ethernet, PCIe, and other serial PHY/MAC interfaces using integrated transceivers for line‑rate packet processing and protocol offload.
• Telecommunications & Wireless Infrastructure  Supports fronthaul/backhaul protocols (CPRI, OBSAI, Serial RapidIO) and high‑throughput data transport with low‑latency DSP and high‑speed serial links.
• Video & Broadcast Processing  Handles SD/HD/3G/ASI Serial Digital Interface (SDI) processing and multi‑lane video transport using on‑chip memory and DSP resources.
• Storage & Datacenter Interfaces  Enables SATA, SAS, Fiber Channel, and other serial storage links with integrated transceivers and timing support.

Unique Advantages

• High Logic Density: 181,165 logic elements let you consolidate complex control and data‑path designs into a single device, reducing board-level BOM and interconnect complexity.
• Substantial On‑Chip Memory: Approximately 10.18 Mbits of embedded RAM enables large buffers, packet queues, and local storage for high‑throughput data handling.
• Integrated High‑Speed Serdes: Up to 24 full‑duplex transceivers supporting up to 6.375 Gbps simplify implementation of modern serial protocols and multi‑lane links.
• Industrial Reliability: Rated for operation from −40 °C to 100 °C and supplied in a surface‑mount FCBGA package, suitable for applications requiring wide temperature tolerance.
• Security‑Aware Configuration: 256‑bit AES programming file encryption options protect design IP during programming and deployment.
• Optimized for DSP: Family DSP features and configurable multiplier modes enable efficient implementation of high‑performance signal processing blocks.

Why Choose EP2AGX190EF29I3G?

The EP2AGX190EF29I3G provides a balanced combination of logic density, embedded memory, high‑speed serial connectivity, and industrial operating range—making it well suited to communications, networking, video, and DSP‑heavy applications. Its Arria II 40‑nm architecture offers a low‑power FPGA engine with on‑chip features that reduce external component count and streamline system integration.

Design teams seeking a configurable platform with substantial on‑chip resources, flexible I/O, and transceiver support will find this device appropriate for mid‑to‑high complexity designs that require reliable operation across a wide temperature range and compact BGA packaging.

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