EP2AGX190EF29I5

The EP2AGX190EF29I5 is an Arria II GX field programmable gate array (FPGA) IC supplied in a 780-FBGA, FCBGA package. It delivers a substantial on-chip logic and memory resource set with a high I/O count and is offered in an industrial temperature grade.

This device is targeted at designs that require large programmable logic capacity, significant embedded memory, and dense I/O connectivity while operating across a wide industrial temperature range.

Key Features

• Programmable Logic Capacity — 181,165 logic elements available for implementing complex digital functions and custom architectures.
• Embedded Memory — Approximately 10.18 Mbits of on-chip RAM to support buffering, FIFO, and local data storage.
• I/O Density — Up to 372 I/O pins to support a variety of peripheral and interface requirements.
• Power and Core Supply — Core voltage supply range of 870 mV to 930 mV as specified for device operation.
• Package and Mounting — 780-BBGA, FCBGA (supplier device package: 780-FBGA 29×29) in a surface-mount format for compact board-level integration.
• Industrial Temperature Rating — Rated for operation from −40 °C to 100 °C, suited to temperature-demanding environments.
• Arria II Family Electrical and I/O Documentation — Device documentation for the Arria II family includes electrical characteristics, transceiver performance specifications, and I/O timing details such as programmable IOE delay and programmable output buffer delay.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• High logic density: 181,165 logic elements provide the capacity to implement large-scale logic designs and complex processing pipelines.
• Substantial embedded memory: Approximately 10.18 Mbits of RAM reduces the need for external memory for many buffering and local-data tasks.
• Flexible external interfacing: 372 I/Os support multiple parallel interfaces and high-pin-count connectivity requirements.
• Industrial-grade operation: Rated −40 °C to 100 °C, enabling deployment in rugged and temperature-variable environments.
• Compact FCBGA package: 780-FBGA (29×29) surface-mount package balances high pin count with board-space efficiency.
• Documented transceiver and I/O timing: Family datasheet coverage of transceiver performance and programmable I/O timing aids system-level timing and signal-integrity planning.

Why Choose EP2AGX190EF29I5?

EP2AGX190EF29I5 positions itself as a resource-rich Arria II GX FPGA option for designs that need a combination of significant logic elements, meaningful on-chip memory, and a high count of I/Os in a single, industrial-grade package. The specified core voltage range and documented electrical characteristics support careful power and timing design.

Its package density and RoHS compliance make it suitable for compact, production-grade board designs where industrial temperature tolerance and detailed I/O/transceiver documentation are required for integration and validation.

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